US2011121719A1PendingUtilityA1

Organic el device and manufacturing method thereof

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Assignee: YOKOYAMA SHUHEIPriority: Nov 25, 2009Filed: Nov 23, 2010Published: May 26, 2011
Est. expiryNov 25, 2029(~3.4 yrs left)· nominal 20-yr term from priority
H10K 59/8792H10K 59/873H10K 59/8722H10K 59/80518H10K 59/123H10K 59/124H10K 2102/3026H10K 50/8426H10K 50/818H10K 50/844H10K 50/865
39
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Claims

Abstract

According to one embodiment, an organic EL device includes an insulative substrate, a switching element above the insulative substrate, an insulation film above the switching element and includes a contact hole reaching the switching element, a pixel electrode above the insulation film and includes a contact portion extending into the contact hole and electrically connected to the switching element, an organic layer extending over the pixel electrode including the contact portion, and extending over the insulation film in a vicinity of the pixel electrode, and a counter-electrode above the organic layer.

Claims

exact text as granted — not AI-modified
1 . An organic EL device comprising:
 an insulative substrate;   a switching element above the insulative substrate;   an insulation film above the switching element and comprising a contact hole reaching the switching element;   a pixel electrode above the insulation film and comprising a contact portion extending into the contact hole and electrically connected to the switching element;   an organic layer extending over the pixel electrode including the contact portion, and extending over the insulation film in a vicinity of the pixel electrode; and   a counter-electrode above the organic layer.   
     
     
         2 . The organic EL device of  claim 1 , wherein the pixel electrode includes (a) a reflective layer which has an upper surface and a first side surface, is above the insulation film, and extends into the contact hole, and a transmissive layer on the upper surface of the reflective layer and comprising a second side surface at a position agreeing with a position immediately above the first side surface, or includes (b) a reflective layer which has an upper surface and is above the insulation film, and a transmissive layer
 an insulation film;   a pixel electrode above the insulation film and comprising a substantially rectangular edge;   a contact hole in the insulation film, located inside the edge of the pixel electrode, and covered by the pixel electrode;   an organic layer extending over the pixel electrode and over the insulation film in a vicinity of the pixel electrode; and   a counter-electrode above the organic layer.   
     
     
         8 . The organic EL device of  claim 7 , wherein the pixel electrode includes (a) a reflective layer which has an upper surface and a first side surface, is above the insulation film, and extends into the contact hole, and a transmissive layer on the upper surface of the reflective layer and comprising a second side surface at a position agreeing with a position immediately above the first side surface, or includes (b) a reflective layer which has an upper surface and is above the insulation film, and a transmissive layer which is on the upper surface of the reflective layer and extends into the contact hole, or includes (c) a reflective layer which has an upper surface and a first side surface, and is above the insulation film, and a transmissive layer which is on the upper surface of the reflective layer, has a second side surface at a part of a position inside a position immediately above the first side surface, and extends into the contact hole. 
     
     
         9 . The organic EL device of  claim 8 , wherein the insulation film comprises a first upper surface on which the pixel electrode is disposed, and a second upper surface which is located in a vicinity of the pixel electrode and is recessed from the first upper surface. 
     
     
         10 . The organic EL device of  claim 7 , wherein the insulation film comprises a first upper surface on which the pixel electrode is disposed, and a second upper surface which is located in a vicinity of the pixel electrode and is recessed from the first upper surface. 
     
     
         11 . The organic EL device of  claim 7 , wherein a taper angle of the contact hole in the insulation film is 40° or less. 
     
     
         12 . The organic EL device of  claim 7 , wherein a film thickness of the organic layer is greater than a film thickness of the pixel electrode. 
     
     
         13 . An organic EL device comprising:
 an insulative substrate;   a first switching element and a second switching element, which are above the insulative substrate;   an insulation film above the first switching element and the second switching element and comprising a first contact hole reaching the first switching element and a second contact hole reaching the second switching element;   a first pixel electrode above on the insulation film and comprising a first contact portion extending into the first contact hole and electrically connected to the first switching element;   a second pixel electrode above the insulation film with being spaced apart from the first pixel electrode, and comprising a second contact portion extending into the second contact hole and electrically connected to the second switching element;   an organic layer extending over the first pixel electrode including the first contact portion, extending over the second pixel electrode including the second contact portion, and extending over the insulation film between the first pixel electrode and the second pixel electrode; and   a counter-electrode above the organic layer.   
     
     
         14 . The organic EL device of  claim 13 , wherein each of the first pixel electrode and the second pixel electrode includes (a) a reflective layer which has an upper surface and a first side surface, is above the insulation film, and extends into the contact hole, and a transmissive layer which is on the upper surface of the reflective layer and comprises a second side surface at a position agreeing with a position immediately above the first side surface, or includes (b) a reflective layer which has an upper surface and is disposed on the insulation film, and a transmissive layer which is stacked on the upper surface of the reflective layer and extends into the contact hole, or includes (c) a reflective layer which has an upper surface and a first side surface, and is above the insulation film, and a transmissive layer which is on the upper surface of the reflective layer, has a second side surface at a part of a position inside a position immediately above the first side surface, and extends into the contact hole. 
     
     
         15 . The organic EL device of  claim 14 , wherein the insulation film has a first upper surface on which the first pixel electrode and the second pixel electrode are disposed, and a second upper surface which is located between the first pixel electrode and the second pixel electrode and is recessed from the first upper surface. 
     
     
         16 . The organic EL device of  claim 13 , wherein the insulation film has a first upper surface on which the first pixel electrode and the second pixel electrode are disposed, and a second upper surface which is located between the first pixel electrode and the second pixel electrode and is recessed from the first upper surface. 
     
     
         17 . The organic EL device of  claim 13 , wherein a taper angle of the contact hole in the insulation film is 40° or less. 
     
     
         18 . The organic EL device of  claim 13 , wherein a film thickness of the organic layer is greater than a film thickness of the first pixel electrode and the second pixel electrode. 
     
     
         19 . A method of manufacturing an organic EL device, comprising:
 forming a switching element above an insulative substrate;   coating an insulation film material on the switching element and patterning the insulation film material to form a contact hole reaching the switching element;   forming an insulation film by baking the insulation film material and then cooling the insulation film material;   forming an electrically conductive layer on the insulation film and in the contact hole, and patterning the electrically conductive layer to form a pixel electrode which is electrically connected to the switching element;   forming an organic layer on the pixel electrode and on the insulation film in a vicinity of the pixel electrode; and   forming a counter-electrode on the organic layer.   
     
     
         20 . The method of  claim 19 , wherein a temperature for baking the insulation film material is a which is on the upper surface of the reflective layer and extends into the contact hole, or includes (c) a reflective layer which has an upper surface and a first side surface, and is above the insulation film, and a transmissive layer which is on the upper surface of the reflective layer, has a second side surface at a part of a position inside a position immediately above the first side surface, and extends into the contact hole. 
     
     
         3 . The organic EL device of  claim 2 , wherein the insulation film comprises a first upper surface on which the pixel electrode is disposed, and a second upper surface which is located in a vicinity of the pixel electrode and is recessed from the first upper surface. 
     
     
         4 . The organic EL device of  claim 1 , wherein the insulation film comprises a first upper surface on which the pixel electrode is disposed, and a second upper surface which is located in a vicinity of the pixel electrode and is recessed from the first upper surface. 
     
     
         5 . The organic EL device of  claim 1 , wherein a taper angle of the contact hole in the insulation film is 40° or less. 
     
     
         6 . The organic EL device of  claim 1 , wherein a film thickness of the organic layer is greater than a film thickness of the pixel electrode. 
     
     
         7 . An organic EL device comprising:
 temperature at which the insulation film material transitions to a molten state.

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