US2011129173A1PendingUtilityA1

Pb-FREE COPPER ALLOY SLIDING MATERIAL AND PLAIN BEARINGS

57
Assignee: TAIHO KOGYO CO LTDPriority: May 15, 2007Filed: May 14, 2008Published: Jun 2, 2011
Est. expiryMay 15, 2027(~0.9 yrs left)· nominal 20-yr term from priority
C22C 1/0425Y02T10/86F16C 2204/12B22F 2998/00F16C 33/121B22F 7/08C22C 9/02C22C 1/05B22F 5/00C22C 9/04C22C 9/00C22C 9/08
57
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

[Task] In the provided Cu-based sliding material, the properties equivalent to those of a Pb-containing material is attained even free of Pb, and material has stable friction coefficient. [Solution Means] A Pb-free copper-alloy sliding material contains 1.0 to 15.0% of Sn, 0.5 to 15.0% of Bi and 0.05 to 5.0% of Ag, and Ag and Bi from an Ag—Bi eutectic. If necessary, at least one of 0.1 to 5.0% of Ni, 0.02 to 0.2% P, and 0.5 to 30.0% of Zn is contained. Further, if necessary, 1.0 to 10.0 mass % of at least one of a group consisting of Fe 3 P, Fe 2 P, FeB, NiB and AlN, having an average particle diameter of 1.5 to 70 μm is contained.

Claims

exact text as granted — not AI-modified
1 . A Pb-free copper-alloy sliding material which contains, by mass percentage, 1.0 to 15.0% of Sn, 0.5 to 15.0% of Bi and 0.05 to 5.0% of Ag, with the balance being Cu and unavoidable impurities, and is characterized in that said Ag and Bi from an Ag—Bi eutectic. 
     
     
         2 . A Pb-free copper-alloy sliding material according to  claim 1 , characterized in that the material further contains, by mass percentage, at least one of 0.1 to 5.0% of Ni, 0.02 to 0.2% P, and 0.5 to 30.0% of Zn. 
     
     
         3 . A Pb-free copper-alloy sliding material according to  claim 1  or  2 , characterized in that the material contains, by mass percentage, 1.0 to 10.0% of at least one of a group consisting of Fe 3 P, Fe 2 P, FeB, NiB and AlN, having an average particle diameter of 1.5 to 70 μm. 
     
     
         4 . A Pb-free copper-alloy sliding material according to  claim 1 , characterized in that neither Ag nor Bi is essentially dissolved in the Cu matrix, and is not precipitated in a morphology except for said Ag—Bi eutectic. 
     
     
         5 . A plain bearing, wherein a Pb-free copper-alloy sliding material according to  claim 1 , is bonded to a backing metal by sintering.

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.