Method for Electrochemically Depositing a Metal on a Substrate

Abstract

To electroplate a metal layer which has silica particles dispersed therein, a method for electrochemically depositing a metal on a substrate, more specifically a method of forming a corrosion-resistant nickel multilayer on a substrate, are provided, wherein the method comprises the following method steps: (a) depositing a first nickel layer having a first electric potential, (b) depositing a second nickel layer having a second electric potential which is more negative than the first electric potential over the first nickel layer and (c) depositing a third nickel layer over the second nickel layer using a solution for electrochemically depositing a metal on a substrate, said solution containing ions of the metal to be deposited and silica particles, wherein at least one silicon containing organic moiety is provided to said silica particles, said silicon containing organic moiety comprising at least one functional group selected from the group comprising amino, quaternized ammonium, quaternized phosphonium and quaternized arsonium which imparts the silica particles a positive electric charge while being in contact with said solution.

1 . A method of forming a corrosion-resistant nickel multilayer on a substrate, wherein the method comprises the following method steps: (a) depositing a first nickel layer having a first electric potential, (b) depositing a second nickel layer having a second electric potential which is more negative than the first electric potential over the first nickel layer and (c) depositing a third nickel layer over the second nickel layer using a solution for electrochemically depositing a metal on a substrate, said solution containing ions of the metal to be deposited and silica particles, wherein at least one silicon containing organic moiety is provided to said silica particles, said silicon containing organic moiety comprising at least one functional group selected from the group comprising amino, quaternized ammonium, quaternized phosphonium and quaternized arsonium which imparts the silica particles a positive electric charge while being in contact with said solution. 
     
     
         2 . The method of forming a corrosion-resistant nickel multilayer on a substrate according to  claim 1 , characterized in that the at least one organic moiety is formed by a reaction of the silica particles with a reagent, wherein the reagent has general chemical Formula I, II, III or IV:
   (R 1 0) 3 Si—R 2 -QR 3 R 4   I
     (R 1 0) 3 Si—R 2 -Q + R 3 R 4 R 5   II
     (R 1 O) 2 Si—R 2 -(QR 3 R 4 ) 2   III
     (R 1 O) 2 Si—R 2 -(Q + R 3 R 4 R 5 ) 2   IV
   wherein   Q is N (nitrogen), P (phosphorus) or As (arsenic)   R 1  and R 2 , independently from each other, are unsubstituted or substituted alkyl, R 3 , R 4  and R 5  are hydrogen, unsubstituted or substituted alkyl, unsubstituted or substituted aryl, wherein R 3 , R 4  and R 5  may, independently from each other, further contain at least one functional radical comprising amino and imino moieties.   
     
     
         3 . The method of forming a corrosion-resistant nickel multilayer on a substrate according to any one of  claims 1 - 2 , characterized in that the at least one organic moiety is formed by a reaction of the silica particles with (3-aminopropyl)triethoxysilane. 
     
     
         4 . The method of forming a corrosion-resistant nickel multilayer on a substrate according to any one of  claims 1 - 2 , characterized in that the silica particles have a specific surface area of up to 300 m 2 /g. 
     
     
         5 . The method of forming a corrosion-resistant nickel multilayer on a substrate according to any one of  claims 1 - 2 , characterized in that the silica particles have a mean diameter in a range of from 0.3 pm to 15 pm. 
     
     
         6 . The method of forming a corrosion-resistant nickel multilayer on a substrate according to any one of  claims 1 - 2 , characterized in that the metal is nickel.