US2011134581A1PendingUtilityA1

Power semiconductor device for igniter

Assignee: MITSUBISHI ELECTRIC CORPPriority: Dec 8, 2009Filed: Sep 8, 2010Published: Jun 9, 2011
Est. expiryDec 8, 2029(~3.4 yrs left)· nominal 20-yr term from priority
F02P 3/0554
36
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Claims

Abstract

A power semiconductor device for an igniter comprises: a semiconductor switching device causing a current to flow through a primary side of an ignition coil or shutting off the current flowing through the primary side of the ignition coil; an integrated circuit driving and controlling the semiconductor switching device; and a temperature sensing element sensing temperature of the semiconductor switching device, wherein the integrated circuit including an overheat protection circuit limiting a current through the semiconductor switching device to a value lower than a current through the semiconductor switching device during normal operation, when temperature sensed by the temperature sensing element is over predetermined temperature.

Claims

exact text as granted — not AI-modified
1 . A power semiconductor device for an igniter comprising:
 a semiconductor switching device causing a current to flow through a primary side of an ignition coil or shutting off the current flowing through the primary side of the ignition coil;   an integrated circuit driving and controlling the semiconductor switching device; and   a temperature sensing element sensing temperature of the semiconductor switching device,   wherein the integrated circuit including an overheat protection circuit limiting a current through the semiconductor switching device to a value lower than a current through the semiconductor switching device during normal operation, when temperature sensed by the temperature sensing element is over predetermined temperature.   
     
     
         2 . The power semiconductor device for an igniter according to  claim 1 , wherein the temperature sensing element and the semiconductor switching device are provided on a common substrate. 
     
     
         3 . The power semiconductor device for an igniter according to  claim 1 , wherein the temperature sensing element and the integrated circuit are provided on a common substrate. 
     
     
         4 . The power semiconductor device for an igniter according to  claim 1 , wherein the temperature sensing element includes a Schottky barrier diode. 
     
     
         5 . The power semiconductor device for an igniter according to  claim 1 , wherein temperature characteristic of the temperature sensing element can be externally adjusted. 
     
     
         6 . The power semiconductor device for an igniter according to  claim 1 , further comprising an overheat protection operation condition output circuit outputting a signal indicating that the overheat protection circuit is limiting the current through the semiconductor switching device.

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