US2011139427A1PendingUtilityA1
Heat dissipation device
Est. expiryDec 10, 2029(~3.4 yrs left)· nominal 20-yr term from priority
Inventors:Ming-Shun Lee
F21V 29/763F21V 29/85F21V 17/101F21V 29/83F21V 29/74F21V 29/51F21Y 2115/10
36
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Claims
Abstract
A heat dissipation device is that at least one rigidly heat-conducting material is disposed to a base of a heat dissipation fin set and extended among heat dissipation fins. At least one flexible superconductor passes through the heat dissipation fins. One end of the flexible superconductor is welded with the rigidly heat-conducting material. A fluid is filled within a flexible tube body of the flexible superconductor and can play a role of rapidly transporting mass of heat in a condition of unchanged temperature to improve the heat conduction efficiency of the heat dissipation fins.
Claims
exact text as granted — not AI-modified1 . A heat dissipation device comprising:
at least one heat dissipation fin set having at least one air current through hole that is correspondingly disposed to a sheet body of each heat dissipation fin and that is taken as a channel of the heat dissipation fin set for circulating air current; at least one rigidly heat-conducting material relatively arranged to a base of the heat dissipation fin set and extended among the sheet bodies of heat dissipation fins; and at least one flexible superconductor relatively passing through the sheet bodies of the heat dissipation fins, wherein one end of the flexible superconductor is welded with the rigidly heat-conducting material.
2 . The heat dissipation device as recited in claim 1 , further comprising a heat conducting and fastening seat, wherein a top surface of the heat conducting and fastening seat has at least one positioning recess portion for containing at least one heat dissipation fin set.
3 . The heat dissipation device as recited in claim 1 , wherein the heat dissipation fin set has at least one buckle notch that is correspondingly disposed to base of the sheet bodies of the heat dissipation fins and that is provided for relatively embedding the rigidly heat-conducting material.
4 . The heat dissipation device as recited in claim 1 , wherein the sheet body of each heat dissipation fin of the heat dissipation fin set has at least one via passed by the flexible superconductor.
5 . The heat dissipation device as recited in claim 1 , wherein rigidly heat-conducting material is a squared shaft structure made of copper, and several positioning points are preset on the shaft structure and provided for positioning each heat dissipation fin.
6 . The heat dissipation device as recited in claim 1 , wherein the flexible superconductor has a flexible tube body, and a fluid is filled within the flexible tube body.Cited by (0)
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