Thermal plug for use with a heat sink and method of assembling same

Abstract

A plug is provided for use with a heat sink body and an electronic device. The plug includes a first plug member and a second plug member. The first plug member defines a socket therein. The second plug member is movable within the socket such that a bottom surface of the second plug member is maintained in a substantially parallel position with respect to a top surface of the electronic device.

1 . A method for assembling a heat sink assembly, said method comprising:
 providing a heat sink body that defines a heat sink cavity therein;   positioning at least a portion of a thermal plug within the heat sink cavity, the thermal plug including a first plug member and a second plug member, wherein the first plug member defines a socket therein, the second plug member being movable within the socket;   positioning a printed circuit board with respect to the thermal plug, the printed circuit board including an electronic device, wherein the second plug member is movable such that a surface of the thermal plug is substantially parallel to a surface of the electronic device.   
     
     
         2 . A method in accordance with  claim 1 , wherein positioning at least a portion of a thermal plug further comprises orienting the first and second plug members such that a surface of the first plug member is adjacent to a surface of the second plug member, wherein the surface of the first plug member is substantially concave, and the surface of the second plug member is substantially convex. 
     
     
         3 . A method in accordance with  claim 1 , further comprising providing a biasing member between the thermal plug and the heat sink body. 
     
     
         4 . A method in accordance with  claim 1 , further comprising providing a thermal interface material between at least two of the heat sink body, the first plug member, the second plug member, and the electronic device. 
     
     
         5 . A method in accordance with  claim 4 , further comprising coupling an adhesive material to at least one of the heat sink body, the first plug member, the second plug member, and the electronic device, wherein the adhesive material facilitates positioning the thermal interface material. 
     
     
         6 . A method in accordance with  claim 5 , wherein coupling an adhesive material further comprises applying the adhesive material in a grid pattern. 
     
     
         7 . A plug for use with a heat sink body and an electronic device, said plug comprising:
 a first plug member defining a socket therein; and   a second plug member movable within the socket such that a bottom surface of said second plug member is maintained in a substantially parallel position with respect to a top surface of the electronic device.   
     
     
         8 . A plug in accordance with  claim 7 , wherein said first plug member includes a bottom surface, and said second plug member includes a top surface that is substantially complementary to the bottom surface of said first plug member, and wherein said first plug member and said second plug member are oriented such that the bottom surface of said first plug member is adjacent to the top surface of said plug member. 
     
     
         9 . A plug in accordance with  claim 8 , wherein the bottom surface of said first plug member is substantially concave, and the top surface of said second plug member is substantially convex. 
     
     
         10 . A plug in accordance with  claim 7 , wherein said first plug member includes a first diameter, and said second plug member includes a second diameter that is substantially equal to the first diameter. 
     
     
         11 . A plug in accordance with  claim 7 , further comprising a biasing member provided between the heat sink body and said first plug member, wherein said first plug member defines a cavity that is sized to receive said biasing member. 
     
     
         12 . A plug in accordance with  claim 7 , further comprising an adhesive material coupled to at least one of said first plug member and said second plug member, wherein said adhesive material is applied in a grid pattern. 
     
     
         13 . A heat sink assembly for use with a printed circuit board coupled to an electronic device, said heat sink assembly comprising:
 a heat sink body that defines a heat sink cavity therein; and   a thermal plug positioned within the heat sink cavity, said thermal plug comprising a first plug member and a second plug member, wherein said first plug member defines a socket therein and said second plug member is movable within the socket such that a bottom surface of said second plug member is maintained in a substantially parallel position with respect to a top surface of the electronic device.   
     
     
         14 . A heat sink assembly in accordance with  claim 13 , wherein said first plug member includes a bottom surface, and said second plug member includes a top surface that is substantially complementary to the bottom surface of said first plug member, and wherein said first plug member and said second plug member are oriented such that the bottom surface of said first plug member is adjacent to the top surface of said second plug member. 
     
     
         15 . A heat sink assembly in accordance with  claim 14 , wherein the bottom surface of said first plug member is substantially concave, and the top surface of said second plug member is substantially convex. 
     
     
         16 . A heat sink assembly in accordance with  claim 13 , wherein said first plug member includes a first diameter, and said second plug member includes a second diameter that is substantially equal to the first diameter. 
     
     
         17 . A heat sink assembly in accordance with  claim 13 , further comprising a biasing member provided between said heat sink body and said first plug member, wherein said first plug member defines a cavity that is sized to receive said biasing member. 
     
     
         18 . A heat sink assembly in accordance with  claim 13 , further comprising a thermal interface material provided between at least two of said heat sink body, said first plug member, said second plug member; and the electronic device. 
     
     
         19 . A heat sink assembly in accordance with  claim 18 , further comprising an adhesive material coupled to at least one of said heat sink body, said first plug member, said second plug member, and the electronic device, wherein said adhesive material facilitates positioning said thermal interface material. 
     
     
         20 . A heat sink assembly in accordance with  claim 19 , wherein said adhesive material is applied in a grid pattern.