US2011177349A1PendingUtilityA1
Process for the modification of substrate surfaces through the deposition of amorphous silicon layers followed by surface functionalization with organic molecules and functionalized structures
Est. expiryDec 13, 2024(expired)· nominal 20-yr term from priority
C23C 16/24C23C 16/56Y10T428/12549Y10T428/12535Y10T428/12674Y10T428/12542Y10T428/31612Y10T428/31667
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Abstract
Functionalized substrates and method of passivating the surface of a substrate to improve the surface by imparting desirable surface properties to improve the performance of a surface, the method steps including exposing the substrate to a chemical vapor deposition process to coat the substrate with silicon, and functionalizing the coated surface by exposing the substrate surface to a binding reagent having at least one unsaturated hydrocarbon group.
Claims
exact text as granted — not AI-modified1 . A method of passivating the surface of a substrate to improve the surface by imparting desirable surface properties to improve the performance of a surface, the method comprising exposing the substrate to a chemical vapor deposition process to coat the substrate with silicon, functionalizing the coated surface by exposing the substrate surface to a binding reagent having at least one unsaturated hydrocarbon group.
2 . The method of claim 1 , wherein the at least one unsaturated hydrocarbon group is covalently bonded to the coated substrate surface.
3 . The method of claim 1 , wherein one or more layers of silicon are deposited on a substrate with intermediate changes in process temperature, pressures and times, to provide a coated substrate surface.
4 . The method of claim 1 , wherein the binding reagent is selected from the group consisting Of hydrocarbons, substituted hydrocarbons, carbonyls, carboxyls, esters, amines, sulfonic acids, and epoxides.
5 . The method of claim 1 , wherein the binding reagent is ethylene.
6 . The method of claim 1 , wherein the functionalization step includes reacting the binding reagent at a temperature of from about 200° C. to about 500° C.
7 . The method of claim 6 , wherein the functionalization step includes reacting the binding reagent at a pressure of from less than about 2500 Torr.
8 . The method of claim 7 , wherein the functionalization step includes reacting the binding reagent for about 30 minutes to about 24 hours.
9 . The method of claim 1 , wherein the substrate surface is placed in a controllable environment for regulation of one or more of temperature and pressure.
10 . The method of claim 9 , wherein the binding reagent is introduced into said controllable environment at a pressure range of from about 1×10 −7 Torr to about 2500 Torr.
11 . The method of claim 10 , wherein the binding reagent is introduced into said controllable environment at a temperature less than about 350° C.
12 . The method of claim 9 , wherein the substrate comprises a vessel and wherein the controllable environment comprises the substrate vessel.
13 . A substrate having an improved surface comprising one or more layers of silicon and being functionalized with an unsaturated hydrocarbon moiety which is covalently bonded to said silicon surface.
14 . The substrate of claim 9 , wherein the unsaturated moiety consists of —CH═CH 2 or —C≡CH.
15 . The substrate of claim 13 , wherein the substrate comprises a vessel with a controllable environment, and wherein said improved surface is disposed within said controllable environment.Cited by (0)
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