Cooling apparatus

Abstract

Disclosed is a cooling apparatus including: a heat receiving plate to which a plurality of heating elements are attached; a radiator plate to which a plurality of Peltier devices are attached; a thermal transport heat pipe that couples the heat receiving plate with the radiator plate; and a heat dissipating device being provided on an exothermic side of the Peltier devices; wherein the plurality of heating elements are arranged along a longitudinal direction of the thermal transport heat pipe, and the plurality of Peltier devices are arranged along the longitudinal direction of the thermal transport heat pipe, whereby, when using a plurality of Peltier devices, reducing power consumption thereof by equalizing each operation of the respective Peltier devices.

1 . A cooling apparatus, comprising:
 a heat receiving plate to which a plurality of heating elements are attached;   a radiator plate to which a plurality of Peltier devices are attached;   a thermal transport heat pipe that couples the heat receiving plate with the radiator plate; and   a heat dissipating device being provided on an exothermic side of the Peltier devices;   wherein the plurality of heating elements are arranged along a longitudinal direction of the thermal transport heat pipe, and   the plurality of Peltier devices are arranged along the longitudinal direction of the thermal transport heat pipe.   
     
     
         2 . The cooling apparatus according to  claim 1 , wherein the heat dissipating device includes:
 a second heat receiving plate in contact with the exothermic sides of the Peltier devices;   a radiating heat pipe coupled to the second heat receiving plate; and   a radiating fin coupled to the radiating heat pipe.   
     
     
         3 . The cooling apparatus according to  claim 2 , wherein a plurality of radiating heat pipes are arranged at the same interval along a direction perpendicular to the longitudinal direction of the thermal transport heat pipe. 
     
     
         4 . The cooling apparatus according to  claim 1 , further comprising:
 a temperature sensor located near a coupling portion between the heat dissipating device and the thermal transport heat pipe;   a plurality of drive circuits for individually driving the respective Peltier devices; and   a control circuit for individually controlling the respective drive circuit based on an output from the temperature sensor.   
     
     
         5 . The cooling apparatus according to  claim 1 , wherein a tip end of the thermal transport heat pipe is protruded from the end face of the heat dissipating device. 
     
     
         6 . The cooling apparatus according to  claim 1 , wherein the heat receiving plate and the radiator plate are coupled by a plurality of thermal transport heat pipes, and
 a smaller amount of liquid is sealed in the heat pipe which is located at a larger distance from the heating element attachment portion.   
     
     
         7 . The cooling apparatus according to  claim 1 , wherein a wick that generates a capillary force is fixed to an inner surface of the thermal transport heat pipe. 
     
     
         8 . The cooling apparatus according to  claim 1 , wherein the thermal transport heat pipe is bent in a U-shape, and
 both ends of the thermal transport heat pipe are thermally coupled by another heat pipe.   
     
     
         9 . The cooling apparatus according to  claim 1 , wherein the thermal transport heat pipe is bent in a U-shape, and
 the heat receiving plate and the radiator plate are integrated into a single piece and disposed perpendicularly to each other.   
     
     
         10 . The cooling apparatus according to  claim 1 , wherein the heating element which is located at a portion closer to the end of the thermal transport heat pipe generates a smaller amount of heat. 
     
     
         11 . The cooling apparatus according to  claim 1 , wherein an electronic or optical device is located at a position other than under a endothermic surface of the Peltier device in a vertical direction. 
     
     
         12 . The cooling apparatus according to  claim 1 , wherein the heat receiving plate is provided with a heater.