US2011187487A1PendingUtilityA1
Inductor formed on a semiconductor substrate
Assignee: UNITED MICROELECTRONICS CORPPriority: Aug 31, 2006Filed: Apr 14, 2011Published: Aug 4, 2011
Est. expiryAug 31, 2026(~0.1 yrs left)· nominal 20-yr term from priority
H10W 20/43H10W 20/497H10D 1/20Y10T29/4902
43
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
An inductor formed on a semiconductor substrate, comprising a coil formed with at least a single metal layer having a plurality of slots and an insulator layer filled in the plurality of slots, wherein the insulator layer is encompassed in the single metal layer and the insulator layer does not cover the top surface of the single metal layer.
Claims
exact text as granted — not AI-modified1 . An inductor formed on a semiconductor substrate, comprising:
a coil formed with at least a single metal layer having a plurality of slots; and an insulator layer filled in the plurality of slots, wherein the insulator layer is encompassed in the single metal layer and the insulator layer does not cover the top surface of the single metal layer.
2 . The inductor of claim 1 , wherein the insulator layer is formed using silicon oxide.
3 . The inductor of claim 1 , wherein the slots are arranged in at least a row.
4 . The inductor of claim 1 , wherein the slots insulator slots have an even and symmetrical distribution in the inductor coil.
5 . The inductor of claim 1 , wherein the coil comprises a plurality of the single metal layers stacked and connected in parallel.
6 . The inductor of claim 1 , wherein the coil comprises a plurality of the single metal layers connected in series.
7 . The inductor of claim 1 , wherein one of the slots shapes as a slim rectangular or is in L-shaped.
8 . An inductor formed on a semiconductor substrate, comprising:
a coil formed with at least a single metal layer having a plurality of slots; and an insulator layer filled in the plurality of slots, wherein the insulator layer is encompassed in the single metal layer and the insulator layer does not cover the top and the bottom surface of the single metal layer.
9 . The inductor of claim 8 , wherein the insulator layer is formed using silicon oxide.
10 . The inductor of claim 8 , wherein the slots are arranged in at least a row.
11 . The inductor of claim 8 , wherein the slots insulator slots have an even and symmetrical distribution in the inductor coil.
12 . The inductor of claim 8 , wherein the coil comprises a plurality of the single metal layers stacked and connected in parallel.
13 . The inductor of claim 8 , wherein the coil comprises a plurality of the single metal layers connected in series.
14 . An inductor formed on a semiconductor substrate, comprising:
a coil formed with at least one single metal layer having a plurality of slots; and an insulator layer filled in the plurality of slots, wherein the insulator layer is encompassed in the single metal layer and the top surface of the insulator layer and the single metal layer is substantially coplanar.
15 . The inductor of claim 14 , wherein the insulator layer is formed using silicon oxide.
16 . The inductor of claim 14 , wherein the slots are arranged in at least a row.
17 . The inductor of claim 14 , wherein the slots insulator slots have an even and symmetrical distribution in the inductor coil.
18 . The inductor of claim 14 , wherein the coil comprises a plurality of the single metal layers stacked and connected in parallel.
19 . The inductor of claim 14 , wherein the coil comprises a plurality of the single metal layers connected in series.
20 . The inductor of claim 14 , wherein one of the slots shapes as a slim rectangular or is in L-shaped.Cited by (0)
No later patents cite this yet.
References (0)
No backward citations on record.