Thermal interface

Abstract

Various embodiments include apparatus and method having a heat source, a thermal management device, and an interface disposed between the thermal management device and the heat source. The interface includes nanostructures to facilitate heat transfer and adhesion between the heat source and the thermal management device.

1 . An apparatus comprising:
 a thermal management device;   a heat source; and   first nanostructures and second nanostructures disposed between the thermal management device and the heat source, the first nanostructures including protrusions, and the second nanostructures including recesses to receive the protrusions.   
     
     
         2 . The apparatus of  claim 1 , wherein at least one of the first and second nanostructures include carbon nanotubes. 
     
     
         3 . The apparatus of  claim 1 , at least one of the first and second nanostructures include deoxyribonucleic acid (DNA) molecules. 
     
     
         4 . The apparatus of  claim 1 , wherein at least one nanostructure of the first nanostructures has a diameter of 0.6 to 1.8 nanometers. 
     
     
         5 . The apparatus of  claim 1 , wherein at least one of the first and second nanostructures include molecules covalently coupling the first nanostructures and second nanostructures. 
     
     
         6 . The apparatus of  claim 4 , wherein the molecules include a flexible polymer molecule. 
     
     
         7 . The apparatus of  claim 1 , wherein the heat source includes an integrated circuit die. 
     
     
         8 . The apparatus of  claim 7 , further comprising a heat dissipation device coupled to the thermal management device. 
     
     
         9 . The apparatus of  claim 8 , further comprising:
 a board; and   solder coupled between the board and the substrate.   
     
     
         10 . The apparatus of  claim 9 , wherein the thermal management device forms an enclosure over the substrate to enclose the heat source. 
     
     
         11 . A method comprising:
 forming a thermal management device;   forming a heat source; and   forming first nanostructures and second nanostructures disposed between the thermal management device and the heat source, the first nanostructures including protrusions, and the second nanostructures including recesses to receive the protrusions.   
     
     
         12 . The method of  claim 11 , wherein forming one of the first and second nanostructures includes forming carbon nanotubes. 
     
     
         13 . The method of  claim 11 , wherein forming at least one of the first and second nanostructures includes forming deoxyribonucleic acid (DNA) molecules in at least one of the first and second nanostructures. 
     
     
         14 . The method of  claim 11 , wherein at least one of the first and second nanostructures is formed by using an arc fullerene generator. 
     
     
         15 . The method of  claim 11 , wherein at least one of the first and second nanostructures is forming by using chemical vapor deposition. 
     
     
         16 . The method of  claim 11 , wherein at least one of the first and second nanostructures is forming by using laser blasting.