Temperature control systems and methods

Abstract

Systems and methods for controlling the temperature of an electrical device is described. The system includes a heat sink system in conjunction with a thermoelectric assembly. The systems and methods are particularly suitable in NEMA- 4 electrical enclosures used in electrical submersible pump applications.

1 . A system for controlling the temperature of an electrical device, comprising:
 a heat sink system in thermal association with heat producing equipment to passively dissipate heat from the device;   a thermoelectric assembly in thermal association with the heat producing equipment to actively transfer heat to or from the device;   a power control system operatively connected to the thermoelectric assembly for activating the thermoelectric assembly to obtain a predetermined temperature of the device; and   a sensor operatively connected to the power control system to provide an input to the power control system indicative of the temperature of the device and for sensing the temperature of the device.   
     
     
         2 . The system of  claim 1 , wherein the electrical device comprises an electrical submersible pump variable speed drive system. 
     
     
         3 . The system of  claim 1 , wherein the electrical device comprises the heat producing equipment and a housing. 
     
     
         4 . The system of  claim 3 , wherein the heat sink system or thermoelectric assembly is associated with the housing. 
     
     
         5 . The system of  claim 3 , wherein the housing is closed and filled with a fluid medium. 
     
     
         6 . The system of  claim 5 , wherein the medium is air. 
     
     
         7 . The system of  claim 6 , further comprising an air circulation device configured for circulating the air within the housing. 
     
     
         8 . The system of  claim 7 , wherein the air circulation device is activated by the power control system to control the level of heat transfer through the thermoelectric assembly. 
     
     
         9 . The system of  claim 1 , wherein the heat sink system is in contact with the heat producing equipment. 
     
     
         10 . The system of  claim 1 , wherein the heat sink system comprises non-condenser and non-evaporator components. 
     
     
         11 . The system of  claim 1 , wherein the heat sink system is configured to dissipate between about 50 to 90 percent of heat in the device at a rate of about 2 to about 20 kBtu/hour. 
     
     
         12 . The system of  claim 1 , wherein the thermoelectric assembly is configured to transfer between about 10 to about 60 percent of heat to or from the device at a rate of about 2 to about 10 kBtu/hour. 
     
     
         13 . The system of  claim 1 , wherein the heat producing equipment produces between about 2 to about 10 kW of heat. 
     
     
         14 . The system of  claim 1 , further comprising a polarity reversal circuit operatively connected between the power control system and the thermoelectric assembly to reverse the heat transfer with respect to the device. 
     
     
         15 . A system for controlling the temperature of an electrical submersible pump variable speed drive system, comprising:
 a housing associated with heat producing equipment;   a heat sink system in thermal association with the heat producing equipment to passively dissipate heat from the variable speed drive system;   a thermoelectric assembly in thermal association with the heat producing equipment to actively transfer heat to or from the variable speed drive system;   a power control system operatively connected to the thermoelectric assembly for activating the thermoelectric assembly to obtain a predetermined temperature of the variable speed drive system; and   a sensor operatively connected to the power control system to provide an input to the power control system indicative of the temperature of the variable speed drive system and for sensing the temperature of the variable speed drive system.   
     
     
         16 . The system of  claim 15 , wherein the thermoelectric assembly is configured to transfer heat from the variable speed drive system at a rate of about 2 to about 10 kBtu/hour. 
     
     
         17 . The system of  claim 16 , wherein the thermoelectric assembly is configured to transfer heat to the variable speed drive system. 
     
     
         18 . The system of  claim 15 , wherein the heat sink system is configured to dissipate heat at a rate of about 2 to about 20 kBtu/hour. 
     
     
         19 . A method of controlling the temperature of an electrical device, which comprises:
 determining the temperature of the air surrounding the electrical device;   passively dissipating heat produced by the electrical device through a heat sink system in thermal association with heat producing equipment; and   actively transferring heat to or from the electrical device through a thermoelectric assembly in thermal association with the heat producing equipment.   
     
     
         20 . The method of  claim 19 , wherein the electrical device comprises the heat producing equipment and a housing. 
     
     
         21 . The method of  claim 19 , wherein the electrical device comprises an electrical submersible pump variable speed drive system. 
     
     
         22 . The method of  claim 19 , further comprising reversing heat transfer through the thermoelectric assembly to provide heat to the electrical device.