US2011214846A1PendingUtilityA1
Heat sink and method for manufacturing the same
Assignee: KUNSHAN JUE CHUNG ELECTRONICS COPriority: Mar 5, 2010Filed: Mar 5, 2010Published: Sep 8, 2011
Est. expiryMar 5, 2030(~3.6 yrs left)· nominal 20-yr term from priority
H10W 40/73H10W 40/226H10W 40/037F28D 15/0275Y10T29/4935B23P 15/26F28D 15/0233B21D 53/02F28F 13/18
27
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Claims
Abstract
A method for manufacturing a heat sink includes steps of: preparing a metallic belt; providing a spraying device for spraying a metallic coating layer on one surface of the metallic belt; providing a stamping device for blanking the metallic belt to form a heat-dissipating fin; and stacking a plurality of heat-dissipating fins to form the heat sink. In this way, the heat-dissipating area and efficiency of the heat sink can be increased. The stability and soldering ability of different materials can be improved. The present invention further provides a heat sink.
Claims
exact text as granted — not AI-modified1 . A method for manufacturing a heat sink, including steps of:
a) preparing a metallic belt; b) providing a spraying device for spraying a metallic coating layer on one surface of the metallic belt; c) providing a stamping device for blanking the metallic belt to form a heat-dissipating fin; and d) stacking a plurality of heat-dissipating fins to form the heat sink.
2 . The method according to claim 1 , wherein the heat-dissipating fin in the step c) is formed into a U shape having two folds corresponding to each other.
3 . The method according to claim 2 , further including a step e) of providing a heat-conducting plate after the step d), the heat-dissipating fins being disposed on the heat-conducting plate.
4 . The method according to claim 3 , further including a step f) of providing a heating device after the step e), the heating device heating the heat-dissipating fins and the heat-conducting plate, thereby connecting the heat-dissipating fins and the heat-conducting plate with the metallic coating layer.
5 . The method according to claim 1 , wherein the heat-dissipating fin in the step c) is formed into a U shape having two folds corresponding to each other, one of the folds is formed with a trough.
6 . The method according to claim 5 , further including a step e′) of providing a heat pipe after the step d), one end of the heat pipe penetrating the trough.
7 . The method according to claim 6 , further including a step f′) of providing a heating device after the step e′), the heating device heating the heat-dissipating fins and the heat pipe, thereby connecting the heat-dissipating fins and the heat pipe with the metallic coating layer.
8 . A heat sink, including a plurality of heat-dissipating fins, wherein one surface of each of the heat-dissipating fins is sprayed to form a metallic coating layer, at least one end of any one of the heat-dissipating fins is bent to have a fold, any two adjacent heat-dissipating fins are connected to each other by stacking the respective folds.
9 . The heat sink according to claim 8 , wherein the heat-dissipating fin is made of aluminum.
10 . The heat sink according to claim 8 , wherein the metallic coating layer is made of copper or nickel.
11 . The heat sink according to claim 8 , wherein the metallic coating layer is formed into a rugged configuration.
12 . The heat sink according to claim 11 , further including a heat-conducting plate, the metallic coating layer being heated to be connected to the heat-conducting plate.
13 . The heat sink according to claim 11 , further including a heat pipe, the heat-dissipating fin being formed with a trough, one end of the heat pipe being received in the trough, the metallic coating layer being heated to be connected to the heat pipe.
14 . The heat sink according to claim 13 , further including a heat-conducting plate in thermal contact with the other end of the heat pipe.Join the waitlist — get patent alerts
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