Resin Composition For Plating Use And Resin Plated Product
Abstract
There is provided a resin composition for plating use in which all of plating adhesion strength, moldability, impact resistance, and low coefficient of linear expansion are excellent; and a resin plated product. The resin composition for plating use of the present invention is characterized by including a graft copolymer (A) formed by graft polymerizing a specific monomer component onto a rubber-like polymer (d) constituted of a conjugated diene-based rubber, and a specific copolymer (B), wherein a proportion of the rubber-like polymer (d) is 10 to 20% by mass, relative to the combined total of the graft copolymer (A) and the copolymer (B) which accounts for 100% by mass, and also 1 to 8 parts by mass of an antioxidant (C) having a melting point of 25 to 100° C. is added, relative to the combined total of the graft copolymer (A) and the copolymer (B) which accounts for 100 parts by mass.
Claims
exact text as granted — not AI-modified1 . A resin composition for plating use comprising:
a graft copolymer (A) formed by graft polymerizing 30 to 60 parts by mass of a monomer component (a) constituted of 60 to 80% by mass of an aromatic vinyl compound (a1), 20 to 40% by mass of a vinyl cyanide compound (a2) and 0 to 20% by mass of another monovinyl compound (a3) copolymerizable with the aromatic vinyl compound (a1) and the vinyl cyanide compound (a2), onto 40 to 70 parts by mass of a rubber-like polymer (d) constituted of a conjugated diene-based rubber (with the proviso that the combined total of the rubber-like polymer (d) and the monomer component (a) accounts for 100 parts by mass); and a copolymer (B) formed by copolymerizing 50 to 80% by mass of an aromatic vinyl compound (b1), 20 to 50% by mass of a vinyl cyanide compound (b2) and 0 to 20% by mass of another monovinyl compound (b3) copolymerizable with the aromatic vinyl compound (b1) and the vinyl cyanide compound (b2), wherein a proportion of the rubber-like polymer (d) is 10 to 20% by mass, relative to the combined total of the graft copolymer (A) and the copolymer (B) which accounts for 100% by mass, and also 1 to 8 parts by mass of an antioxidant (C) having a melting point of 25 to 100° C. is added, relative to the combined total of the graft copolymer (A) and the copolymer (B) which accounts for 100 parts by mass.
2 . The resin composition for plating use according to claim 1 ,
wherein the antioxidant (C) is at least one kind of antioxidant selected from the group consisting of hindered phenol-based antioxidants, thioether-based antioxidants, phosphorus-based antioxidants and sulfur-based antioxidants.
3 . A resin plated product being produced by conducting, on a molded article obtained by molding the resin composition for plating use of claim 1 or 2 , an etching treatment using a permanganate solution, and then a treatment using a Pd—Sn colloidal catalyst, followed by, without performing an accelerator treatment or an electroless plating treatment, a conversion treatment into conductors and an electroplating treatment.Join the waitlist — get patent alerts
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