Heat dissipation housing for led lamp
Abstract
The present invention is to provide a heat dissipation housing for an LED lamp, which is made as a one-piece member by metal casting and formed with a receiving channel axially passing therethrough. A plurality of cooling fins axially are formed on an outer surface of the housing, wherein each said cooling fin is radially extended out of the housing and formed therein with a plurality of heat dissipation holes, and has two opposite sides with an included angle defined therebetween. Therefore, when an LED lamp installed on an end of the receiving channel starts to emit light, heat exchange between the LED lamp and the ambient cooling air outside the housing can be carried out through the cooling fins and the heat dissipation holes by both of thermal conduction and thermal convection, so as to effectively enhance the heat dissipation efficiency of the housing for the LED lamp.
Claims
exact text as granted — not AI-modified1 . A heat dissipation housing for an LED lamp, the heat dissipation housing being formed as a one-piece member by metal casting and comprising:
a receiving channel axially passing through the heat dissipation housing; a plurality of cooling fins axially formed on an outer surface of the heat dissipation housing, wherein each said cooling fin is radially extended out of the heat dissipation housing and formed therein with a plurality of heat dissipation holes, and axis of the heat dissipation hole is parallel to axis of the receiving channel; and a plurality of recesses being provided on an inner surface of the heat dissipation housing, each said recess corresponding to one said cooling fin and extending along an axial direction of the heat dissipation housing.
2 . The heat dissipation housing according to claim 1 , wherein a first included angle is defined between two opposite sides of each said cooling fin.
3 . The heat dissipation housing according to claim 2 , wherein a radial length of each said cooling fin adjacent to a first end of the heat dissipation housing is smaller than that of each said cooling fin adjacent to a second end of the heat dissipation housing.
4 . The heat dissipation housing according to claim 3 , wherein a radial depth of each said recess adjacent to the first end of the heat dissipation housing is smaller than that of each said recess adjacent to the second end of the heat dissipation housing, wherein each said recess is communicated with the heat dissipation holes.
5 . The heat dissipation housing according to claim 4 , wherein an upper surface of the second end of the heat dissipation housing is formed with at least one screw-connection hole.Join the waitlist — get patent alerts
Track US2011232886A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.