US2011240256A1PendingUtilityA1

Heat dissipater mounting structure

Assignee: KUNSHAN JUE CHOUNG ELECTRONICS CO LTDPriority: Apr 6, 2010Filed: Apr 6, 2010Published: Oct 6, 2011
Est. expiryApr 6, 2030(~3.7 yrs left)· nominal 20-yr term from priority
H10W 40/641H10W 40/73F28D 15/0275
27
PatentIndex Score
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Claims

Abstract

A mounting structure is provided for a heat dissipater, including a heat plate having a surface on which a radiator is positioned. A plurality of retention members is set on side margin portions of the surface of the heat plate. The retention members are secured to the heat plate in a locked manner, so that the retention members help spreading stress to realize stable and secure mounting and enhance the performance of heat transfer.

Claims

exact text as granted — not AI-modified
1 . A heat dissipater mounting structure, comprising:
 a heat plate;   at least one radiator, which is positioned on a surface of the heat plate; and   a plurality of retention members, which is respectively set on side margin portions of the surface of the heat plate and comprises a plurality of fasteners that secures the retention members to the heat plate.   
     
     
         2 . The mounting structure of heat dissipation device as claimed in  claim 1 , wherein the surface of the heat plate comprises a plurality of side margin portions and wherein two retention members are respectively set on two opposite side margin portions of the surface of the heat plate. 
     
     
         3 . The mounting structure of heat dissipation device as claimed in  claim 1 , wherein the heat plate comprises an extension section on which the radiator is positioned. 
     
     
         4 . The mounting structure of heat dissipation device as claimed in  claim 1 , wherein the heat plate forms a plurality of first mounting holes, the retention members forming a plurality of second mounting holes corresponding to the first mounting holes, the fasteners being respectively received through the first mounting holes and the second mounting holes to secure the retention members to the heat plate. 
     
     
         5 . The mounting structure of heat dissipation device as claimed in  claim 4 , wherein each of the retention members comprises two inclined sections and a flat section, the two inclined sections being respectively connected to two opposite ends of the flat section, the inclined sections forming the second mounting holes, the flat section being positionable on the surface of the heat plate. 
     
     
         6 . The mounting structure of heat dissipation device as claimed in  claim 1 , wherein the fasteners comprise bolts and C clips. 
     
     
         7 . The mounting structure of heat dissipation device as claimed in  claim 1 , wherein the radiator comprises a plurality of stacked heat dissipation fins or heat pipes. 
     
     
         8 . The mounting structure of heat dissipation device as claimed in  claim 1 , wherein the radiator comprises a plurality of stacked heat dissipation fins and heat pipes. 
     
     
         9 . The mounting structure of heat dissipation device as claimed in  claim 1 , wherein a pad is arranged between each of the retention members and the surface of the heat plate.

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