Enhanced Electronic Cooling by an Inner Fin Structure in a Vapor Chamber

Abstract

A vapor chamber cooling apparatus to cool an electronic component includes a sealed, hollow metal chamber; a working fluid disposed within the metal chamber; a wick structure disposed along an inner surface of the metal chamber; and an inner fin structure disposed within with the metal chamber. An area of the metal chamber is in thermal contact with the electronic component. The inner fin structure is in thermal contact with the metal chamber. A method of manufacturing a vapor chamber cooling apparatus to cool an electronic component includes providing a metal chamber, wherein an area of the metal chamber thermally contacts the electronic component; disposing a wick structure along an inner surface of the metal chamber; disposing a working fluid within the metal chamber; and disposing an inner fin structure within the metal chamber and in thermal contact with the metal chamber.

1 . A vapor chamber cooling apparatus to cool an electronic component, the apparatus comprising:
 a sealed, hollow metal chamber, wherein an area of the metal chamber is in thermal contact with the electronic component;   a working fluid disposed within the metal chamber;   a wick structure disposed along an inner surface of the metal chamber; and   an inner fin structure disposed within with the metal chamber, wherein the inner fin structure is in thermal contact with the metal chamber.   
     
     
         2 . The apparatus of  claim 1 , wherein at least a portion of the inner fin structure is positioned at the area of the metal chamber in thermal contact with the electrical component. 
     
     
         3 . The apparatus of  claim 1 , wherein the wick structure is disposed along a surface of the inner fin structure. 
     
     
         4 . The apparatus of  claim 1 , wherein the inner fin structure comprises the same material as the wick structure. 
     
     
         5 . The apparatus of  claim 1 , wherein the inner fin structure traverses the metal chamber and is in thermal contact with at least two sides of the metal chamber. 
     
     
         6 . The apparatus of  claim 1 , wherein the metal chamber comprises copper, aluminum, copper and aluminum alloys, stainless steel, or any combination thereof. 
     
     
         7 . The apparatus of  claim 1 , wherein the inner fin structure comprises copper, aluminum, copper and aluminum alloys, stainless steel, or any combination thereof. 
     
     
         8 . The apparatus of  claim 1 , wherein the inner fin structure comprises a post structure, a radiating structure having a plurality of radial prongs, a branched structure, or any combination thereof. 
     
     
         9 . The apparatus of  claim 1  further comprising: an outer fin structure disposed on an outside of the metal chamber, wherein the outer fin structure is in thermal contact with the metal chamber. 
     
     
         10 . A method of manufacturing a vapor chamber cooling apparatus to cool an electronic component, the method comprising:
 providing a metal chamber, wherein an area of the metal chamber thermally contacts the electronic component;   disposing a wick structure along an inner surface of the metal chamber;   disposing a working fluid within the metal chamber; and   disposing an inner fin structure within the metal chamber and in thermal contact with the metal chamber.   
     
     
         11 . The method of  claim 10 , wherein the inner fin structure and the metal chamber are manufactured separately, the method further comprising: welding the inner fin structure to the metal chamber. 
     
     
         12 . The method of  claim 10 , wherein the inner fin structure is manufactured by stamping, casting, machining, or any combination thereof. 
     
     
         13 . The method of  claim 10 , wherein the inner fin structure is manufactured as part of the metal chamber. 
     
     
         14 . The method of  claim 10 , wherein the wick structure is manufactured by sintering, screening, grooving, or any combination thereof. 
     
     
         15 . The method of  claim 10 , wherein the wick structure is disposed along a surface of the inner fin structure. 
     
     
         16 . The method of  claim 10  further comprising: positioning at least a portion of the inner fin structure at the area of the metal chamber in thermal contact with the electronic component. 
     
     
         17 . The method of  claim 10  further comprising: arranging the inner fin structure to traverse the metal chamber and thermally contact at least two sides of the metal chamber. 
     
     
         18 . The method of  claim 10 , wherein the inner fin structure comprises a post structure, a radiating structure having a plurality of radial prongs, a branched structure, or any combination thereof. 
     
     
         19 . The method of  claim 10  further comprising: disposing an outer fin structure on an outside of the metal chamber, wherein the outer fin structure is in thermal contact with the metal chamber. 
     
     
         20 . A vapor chamber cooling apparatus to cool an electronic component, the apparatus comprising:
 a sealed, hollow metal chamber, wherein an area of the metal chamber is in thermal contact with the electronic component;   a working fluid disposed within the metal chamber;   an outer fin structure disposed on an outside of the metal chamber, wherein the outer fin structure is in thermal contact with the metal chamber;   an inner fin structure disposed within with the metal chamber and positioned at the area of the metal chamber in thermal contact with the electrical component; and   a wick structure disposed along an inner surface of the metal chamber and along a surface of the inner fin structure;   wherein the inner fin structure is arranged to traverse the metal chamber and thermally contact with at least two sides of the metal chamber,   wherein the metal chamber comprises copper, aluminum, copper and aluminum alloys, stainless steel, or any combination thereof,   wherein the inner fin structure comprises copper, aluminum, copper and aluminum alloys, stainless steel, or any combination thereof, and   wherein the inner fin structure comprises a post structure, a radiating structure having a plurality of radial prongs, a branched structure, or any combination thereof.