US2011247546A1PendingUtilityA1
Ribbon Crystal String for Increasing Wafer Yield
Est. expiryAug 31, 2027(~1.1 yrs left)· nominal 20-yr term from priority
C30B 15/34C04B 35/62871C04B 2235/5248Y10T117/1032Y10T428/30C30B 15/36C04B 35/62868Y10T428/24479Y10T428/24628C04B 35/62863Y10T428/2942C30B 35/00Y10T428/2918Y10T428/2929C04B 35/62894C04B 35/62849Y10T428/2962C04B 35/62873C04B 35/62852
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Abstract
A ribbon crystal has a body with a width dimension, and string embedded within the body. The string has a generally elongated cross-sectional shape. This cross-section (of the string) has a generally longitudinal axis that diverges with the width dimension of the ribbon crystal body.
Claims
exact text as granted — not AI-modified1 . A method of forming a ribbon crystal, the method comprising:
providing molten material having a material coefficient of thermal expansion; providing a string having an outer surface with a contact angle with the molten material of between about 15 and 120 degrees, the string also having a string coefficient of thermal expansion that is substantially matched to the material coefficient of thermal expansion; and passing the string through molten material to form a sheet.
2 . The method as defined by claim 1 wherein the string comprises a refractory layer supported on a substrate.
3 . The method as defined by claim 2 wherein the string comprises a handling layer radially outward of the refractory layer.
4 . The method as defined by claim 3 wherein the outer surface of the string comprises the handling layer.
5 . The method as defined by claim 3 wherein the string comprises a reduced wetting layer radially outward of the handling layer, the reduced wetting layer comprising the outer surface of the string.
6 . The method as defined by claim 1 wherein the material comprises a silicon based material.Cited by (0)
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