Method and apparatus for fabricating integrated circuit device using self-organizing function

Abstract

In a method of fabricating an integrated circuit device having a three-dimensional stacked structured, the step of fixing many chip-shaped semiconductor circuits to a support substrate or a circuit layer with a predetermined layout can be performed easily and efficiently with a desired accuracy. Temporary adhesion portions 12 b of semiconductor chips 13 are temporarily adhered to corresponding temporary adhesion regions 72 a of a carrier substrate 73 a by way of water films 81 . The carrier substrate 73 a is then pressed toward a support substrate or a desired circuit layer, thereby contacting connecting portions 12 of the chips 13 on the carrier substrate 73 a with corresponding predetermined positions on the support substrate or a circuit layer. Thereafter, by fixing the connecting portions 12 to the predetermined positions, the chips 13 are attached to the support substrate or the circuit layer with a desired layout.

1 - 35 . (canceled) 
     
     
         36 . An apparatus for fabricating an integrated circuit device, comprising:
 a body;   a workpiece holding system for holding a support member for transfer or a support substrate;   a tray holding system, provided on the body, for holding a tray for collective placement;   a control stage, provided on the body, for making at least one of the workpiece holding system and the tray holding system displaceable; and   a position aligning means for performing positional alignment of the support member for transfer or the support substrate held by the tray holding system and the tray for collective placement held by the tray holding system.   
     
     
         37 . The apparatus according to  claim 36 , wherein the position aligning means comprises:
 a light source;   an image pickup device for receiving a light beam emitted from the light source by way of the workpiece holding system and the tray holding system to pick up an image; and   an arithmetic unit for conducting an arithmetic operation using image data obtained by the image pickup device;   wherein the positional alignment of the support member or the support substrate and the tray for collective placement is performed using the arithmetic unit.   
     
     
         38 . The apparatus according to  claim 36 , wherein the position aligning means comprises:
 an image pickup device for picking up images of the support member for transfer or the support substrate held by the workpiece holding system and the tray for collective placement held by the tray holding system; and   an arithmetic unit for conducting an arithmetic operation using image data obtained by the image pickup device;
 wherein the positional alignment of the support member or the support substrate and the tray is performed using the arithmetic unit.