Semiconductor Device and Manufacturing Method Thereof

Abstract

A semiconductor device manufactured utilizing an SOI substrate, in which defects due to an end portion of an island-shaped silicon layer are prevented and the reliability is improved, and a manufacturing method thereof. The following are included: an SOI substrate in which an insulating layer and an island-shaped silicon layer are stacked in order over a support substrate; a gate insulating layer provided over one surface and a side surface of the island-shaped silicon layer; and a gate electrode which is provided over the island-shaped silicon layer with the gate insulating layer interposed therebetween. The gate insulating layer is formed such that the dielectric constant in the region which is in contact with the side surface of the island-shaped silicon layer is lower than that over the one surface of the island-shaped silicon layer.

1 - 21 . (canceled) 
     
     
         22 . A semiconductor device comprising:
 a substrate;   an insulating layer over the substrate;   an island-shaped semiconductor layer over the insulating layer;   a gate insulating layer including:
 a first insulating layer in contact with a top surface of the island-shaped semiconductor layer; 
 a second insulating layer in contact with a side surface of the island-shaped semiconductor layer; and 
   a gate electrode over the gate insulating layer, wherein the gate electrode is provided so as to get across the island-shaped semiconductor layer,   wherein a dielectric constant of the second insulating layer is lower than a dielectric constant of the first insulating layer, and   wherein a surface of the second insulating layer is curved convexly with respect to the side surface of the island-shaped semiconductor layer.   
     
     
         23 . The semiconductor device according to  claim 22 , wherein the island-shaped semiconductor layer is a silicon layer. 
     
     
         24 . The semiconductor device according to  claim 22 , wherein a part of the second insulating layer is overlapped with the gate electrode. 
     
     
         25 . The semiconductor device according to  claim 22 , wherein the gate insulating layer which is in contact with the side surface of the island-shaped semiconductor layer is thicker than that in contact with the top surface of the island-shaped semiconductor layer. 
     
     
         26 . The semiconductor device according to  claim 25 , wherein a thickness of the gate insulating layer satisfies t 1 <t 2 ≦3t 1 , where the t 1  is a thickness of a region in contact with the top surface of the island-shaped semiconductor layer, and the t 2  is a thickness of a region in contact with the side surface of the island-shaped semiconductor layer. 
     
     
         27 . The semiconductor device according to  claim 22 , wherein the gate insulating layer includes a third insulating layer which is interposed between the first insulating layer and the second insulating layer. 
     
     
         28 . The semiconductor device according to  claim 22 , wherein a taper angle of an end portion of the island-shaped semiconductor layer is 45° or more and less than 95°. 
     
     
         29 . The semiconductor device according to  claim 22 , wherein the substrate is a silicon substrate. 
     
     
         30 . The semiconductor device according to  claim 22 , wherein the insulating layer is a buried oxide film. 
     
     
         31 . The semiconductor device according to  claim 22 , wherein the semiconductor device is one selected from the group consisting of an RFID tag, an ID tag, an IC tag, an IC chip, an RF tag, a wireless tag, an electronic tag, and a wireless chip. 
     
     
         32 . A semiconductor device comprising:
 a substrate;   an insulating layer over the substrate;   an island-shaped semiconductor layer over the insulating layer;   a gate insulating layer including:
 a first insulating layer in contact with a top surface of the island-shaped semiconductor layer; 
 a second insulating layer in contact with a side surface of the island-shaped semiconductor layer; and 
   a gate electrode over the gate insulating layer, wherein the gate electrode is provided so as to get across the island-shaped semiconductor layer, and wherein the gate electrode contains a first conductive layer and a second conductive layer over the first conductive layer,   wherein a dielectric constant of the second insulating layer is lower than a dielectric constant of the first insulating layer, and   wherein a surface of the second insulating layer is curved convexly with respect to the side surface of the island-shaped semiconductor layer.   
     
     
         33 . The semiconductor device according to  claim 32 , wherein the island-shaped semiconductor layer is a silicon layer. 
     
     
         34 . The semiconductor device according to  claim 32 , wherein a part of the second insulating layer is overlapped with the gate electrode. 
     
     
         35 . The semiconductor device according to  claim 32 , wherein the gate insulating layer which is in contact with the side surface of the island-shaped semiconductor layer is thicker than that in contact with the top surface of the island-shaped semiconductor layer. 
     
     
         36 . The semiconductor device according to  claim 35 , wherein a thickness of the gate insulating layer satisfies t 1 <t 2 ≦3t 1 , where the t 1  is a thickness of a region in contact with the top surface of the island-shaped semiconductor layer, and the t 2  is a thickness of a region in contact with the side surface of the island-shaped semiconductor layer. 
     
     
         37 . The semiconductor device according to  claim 32 , wherein the gate insulating layer includes a third insulating layer which is interposed between the first insulating layer and the second insulating layer. 
     
     
         38 . The semiconductor device according to  claim 32 , wherein a taper angle of an end portion of the island-shaped semiconductor layer is 45° or more and less than 95°. 
     
     
         39 . The semiconductor device according to  claim 32 , wherein the substrate is a silicon substrate. 
     
     
         40 . The semiconductor device according to  claim 32 , wherein the insulating layer is a buried oxide film. 
     
     
         41 . The semiconductor device according to  claim 32 , wherein the semiconductor device is one selected from the group consisting of an RFID tag, an ID tag, an IC tag, an IC chip, an RF tag, a wireless tag, an electronic tag, and a wireless chip. 
     
     
         42 . A semiconductor device comprising:
 a substrate;   an insulating layer over the substrate;   an island-shaped semiconductor layer over the insulating layer;   a gate insulating layer including:
 a first insulating layer in contact with a top surface of the island-shaped semiconductor layer; 
 a second insulating layer in contact with a side surface of the island-shaped semiconductor layer; and 
   a gate electrode over the gate insulating layer, wherein the gate electrode is provided so as to get across the island-shaped semiconductor layer, wherein the gate electrode contains a first conductive layer and a second conductive layer over the first conductive layer, and wherein the first conductive layer is wider than the second conductive layer,   wherein a dielectric constant of the second insulating layer is lower than a dielectric constant of the first insulating layer, and   wherein a surface of the second insulating layer is curved convexly with respect to the side surface of the island-shaped semiconductor layer.   
     
     
         43 . The semiconductor device according to  claim 42 , wherein the island-shaped semiconductor layer is a silicon layer. 
     
     
         44 . The semiconductor device according to  claim 42 , wherein the second insulating layer is overlapped with the gate electrode. 
     
     
         45 . The semiconductor device according to  claim 42 , wherein the gate insulating layer which is in contact with the side surface of the island-shaped semiconductor layer is thicker than that in contact with the top surface of the island-shaped semiconductor layer. 
     
     
         46 . The semiconductor device according to  claim 45 , wherein a thickness of the gate insulating layer satisfies t 1 <t 2 ≦3t 1 , where the t 1  is a thickness of a region in contact with the top surface of the island-shaped semiconductor layer, and the t 2  is a thickness of a region in contact with the side surface of the island-shaped semiconductor layer. 
     
     
         47 . The semiconductor device according to  claim 42 , wherein the gate insulating layer includes a third insulating layer which is interposed between the first insulating layer and the second insulating layer. 
     
     
         48 . The semiconductor device according to  claim 42 , wherein a taper angle of an end portion of the island-shaped semiconductor layer is 45° or more and less than 95°. 
     
     
         49 . The semiconductor device according to  claim 42 , wherein the substrate is a silicon substrate. 
     
     
         50 . The semiconductor device according to  claim 42 , wherein the insulating layer is a buried oxide film. 
     
     
         51 . The semiconductor device according to  claim 42 , wherein the semiconductor device is one selected from the group consisting of an RFID tag, an ID tag, an IC tag, an IC chip, an RF tag, a wireless tag, an electronic tag, and a wireless chip.