US2011256002A1PendingUtilityA1
Electric Compressor Having Drive Circuit Integrated Thereinto
Est. expiryDec 18, 2028(~2.4 yrs left)· nominal 20-yr term from priority
Inventors:Hideo Ikeda
F04C 29/047F04B 35/04F04B 39/06F04C 18/0215F04C 23/008F04C 2210/261F04C 2210/263F04C 2240/808
49
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Claims
Abstract
Disclosed is a drive circuit-integrated electric compressor, which is adapted to cool a power semiconductor element in a motor drive circuit with good efficiency without increasing the temperature of sucked refrigerant gas and while suppressing increase in pressure loss in a path for cooling. Specifically disclosed is a drive circuit-integrated electric compressor into which a motor drive circuit having a power semiconductor element is incorporated integrally, characterized in that the electric compressor is configured so that the power semiconductor element in the drive circuit is cooled by refrigerant gas to be discharged.
Claims
exact text as granted — not AI-modified1 . A drive circuit-integrated electric compressor into which a motor drive circuit having a power semiconductor element is incorporated integrally, wherein said electric compressor is configured so that said power semiconductor element in said drive circuit is cooled by refrigerant gas to be discharged.
2 . The drive circuit-integrated electric compressor according to claim 1 , wherein said power semiconductor element is a wide band gap semiconductor element.
3 . The drive circuit-integrated electric compressor according to claim 1 , wherein said power semiconductor element is mounted on a high heat-conduction circuit board and a back surface of said circuit board is configured to be cooled by refrigerant gas to be discharged through a wall of said compressor.
4 . The drive circuit-integrated electric compressor according to claim 1 , wherein said power semiconductor element is coated with a low heat-conduction resin.
5 . The drive circuit-integrated electric compressor according to claim 1 , wherein a low heat-conduction heat-shielding member is placed at a position between said power semiconductor element and other electronic parts.
6 . The drive circuit-integrated electric compressor according to claim 1 , wherein CO 2 is used as refrigerant.
7 . The drive circuit-integrated electric compressor according to claim 1 , wherein HFC1234yf is used as refrigerant.
8 . The drive circuit-integrated electric compressor according to claim 1 , wherein said refrigerant gas to be discharged for cooling said power semiconductor element in said drive circuit is refrigerant gas to be discharged which has passed through a built-in motor and a compression part in this order.
9 . The drive circuit-integrated electric compressor according to claim 1 , wherein said refrigerant gas to be discharged for cooling said power semiconductor element in said drive circuit is refrigerant gas to be discharged which has passed through a compression part and a built-in motor in this order.
10 . The drive circuit-integrated electric compressor according to claim 1 , wherein said refrigerant gas to be discharged for cooling said power semiconductor element in said drive circuit is refrigerant gas to be discharged which passes through a built-in motor part after having passed through a compression part.
11 . The drive circuit-integrated electric compressor according to claim 1 , wherein said electric compressor is a scroll-type compressor.
12 . The drive circuit-integrated electric compressor according to claim 1 , wherein said electric compressor is a compressor mounted on a vehicle.
13 . The drive circuit-integrated electric compressor according to claim 1 , wherein said electric compressor is a compressor installed in a refrigeration circuit of an air conditioning system for vehicles.Cited by (0)
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