Prepreg, method for manufacturing prepreg, substrate, and semiconductor device

Abstract

A prepreg which can meet a demand for thickness reduction is provided. The prepreg has first and second resin layers having different applications, functions, capabilities, or properties, and allows an amount of a resin composition in each of the first and second resin layers to be set appropriately depending on a circuit wiring portion to be embedded into the second resin layer. Further, a method for manufacturing the above prepreg, and a substrate and a semiconductor device having the prepreg are also provided. The prepreg according to the present invention includes a core layer including a sheet-shaped base member and having one surface and the other surface which is opposite to the one surface, the first resin layer provided on the one surface of the core layer and formed of a first resin composition, and the second resin layer provided on the other surface of the core layer and formed of a second resin composition, wherein at least one of a requirement that a thickness of the first resin layer is different from that of the second resin layer and a requirement that a constitution of the first resin composition is different from that of the second resin composition is satisfied.

1 - 24 . (canceled) 
     
     
         25 . A substrate, comprising;
 a prepreg; and   a circuit wiring portion   the prepreg including:   a core layer including a sheet-shaped base member, the core layer having one surface and another surface that is opposite the one surface,   a first resin layer provided on the one surface of the core layer, the first resin layer being formed of a first resin composition, and   a second resin layer provided on the another surface of the core layer, the second resin layer being formed of a second resin composition,   wherein at least one of a requirement that a thickness of the first resin layer be different from that of the second resin layer, and a requirement that a constitution of the first resin composition be different from that of the second resin composition is satisfied, and   wherein the circuit wiring portion is embedded into the second resin layer of the prepreg.   
     
     
         26 . The substrate as claimed in  claim 25 , wherein when a total thickness of the prepreg is defined by T0 μm and a height of the circuit wiring portion is defined by t1 μm, a difference of T0 and t1 is 35 μm or less. 
     
     
         27 . The substrate as claimed in  claim 25 , wherein a thermal expansion coefficient of the prepreg in a plane direction thereof is 16 ppm or less. 
     
     
         28 . A substrate comprising a laminate of a plurality of prepregs, each prepreg including:
 a core layer including a sheet-shaped base member, the core layer having one surface and another surface that is opposite the one surface,   a first resin layer provided on the one surface of the core layer, the first resin layer being formed of a first resin composition, and   a second resin layer provided on the another surface of the core layer, the second resin layer being formed of a second resin composition,   
       wherein at least one of a requirement that a thickness of the first resin layer be different from that of the second resin layer, and a requirement that a constitution of the first resin composition be different from that of the second resin composition is satisfied. 
     
     
         29 . A semiconductor device, comprising;
 a substrate including a prepreg, and a circuit wiring portion, the prepreg including:
 a core layer including a sheet-shaped base member, the core layer having one surface and another surface that is opposite the one surface, 
 a first resin layer provided on the one surface of the core layer, the first resin layer being formed of a first resin composition, and 
 a second resin layer provided on the another surface of the core layer, the second resin layer being formed of a second resin composition, 
 wherein at least one of a requirement that a thickness of the first resin layer be different from that of the second resin layer, and a requirement that a constitution of the first resin composition be different from that of the second resin composition is satisfied, and 
 wherein the circuit wiring portion is embedded into the second resin layer of the prepreg; and 
   a semiconductor element mounted on the substrate.   
     
     
         30 . A semiconductor device having a substrate comprising a laminate of a plurality of prepregs, each prepreg including:
 a core layer including a sheet-shaped base member, the core layer having one surface and another surface that is opposite the one surface,   a first resin layer provided on the one surface of the core layer, the first resin layer being formed of a first resin composition, and   a second resin layer provided on the another surface of the core layer, the second resin layer being formed of a second resin composition,   wherein at least one of a requirement that a thickness of the first resin layer be different from that of the second resin layer, and a requirement that a constitution of the first resin composition be different from that of the second resin composition is satisfied.