US2011256658A1PendingUtilityA1
Method for producing photovoltaic cell
Est. expiryFeb 5, 2030(~3.5 yrs left)· nominal 20-yr term from priority
Inventors:Youichi MachiiMasato YoshidaTakashi NojiriKaoru OkaniwaMitsunori IwamuroShuuichirou AdachiAkihiro OritaTetsuya SatoKeiko Kizawa
H10P 32/171H10P 32/141H10P 32/19H10F 77/1223H10F 77/219H10F 71/121H10F 10/146H10F 10/14C03C 3/21C03C 3/062C03C 4/0035C03C 12/00C03C 3/16C03C 3/097Y02P70/50Y02E10/547
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Claims
Abstract
In a method for producing a photovoltaic cell, the improvement comprising: 1) coating a portion of a semiconductor substrate with a layer of a composition comprising donor element-containing glass particles and a dispersion medium, and 2) heating the coated semiconductor substrate to a temperature sufficient to cause donor element diffusion from the glass particles into the semiconductor substrate so as to form an n-type diffusion region in the semiconductor substrate.
Claims
exact text as granted — not AI-modified1 . In a method for producing a photovoltaic cell, the improvement comprising:
1) coating a portion of a semiconductor substrate with a layer of a composition comprising donor element-containing glass particles and a dispersion medium, and 2) heating the coated semiconductor substrate to a temperature sufficient to cause donor element diffusion from the glass particles into the semiconductor substrate so as to form an n-type diffusion region in the semiconductor substrate.
2 . The improvement of claim 1 , wherein the layer of the composition is dried before step 2).
3 . The improvement of claim 2 , wherein the drying is conducted at a temperature in a range of about 80° C. to about 300° C.
4 . The improvement of claim 1 , wherein the heating in step 2) is conducted at a temperature in a range of about 600° C. to about 1200° C.
5 . The improvement of claim 1 , wherein the heating in step 2) is conducted for a period of time in a range from about one minute to about 60 minutes.
6 . The improvement of claim 5 , wherein the heating in step 2) is conducted for a period of time in a range from about 2 minutes to about 30 minutes.
7 . The improvement of claim 1 , wherein the semiconductor substrate is silicon.
8 . The improvement of claim 1 , wherein a glass layer formed on the surface of the semiconductor substrate in step 2) is subsequently removed.
9 . The improvement of claim 8 , wherein the glass layer formed on the surface of the semiconductor substrate in step 2) is removed by etching.
10 . The improvement of claim 1 , wherein the glass particles contain a donor element selected from the group consisting of phosphorus and antimony.
11 . The improvement of claim 1 , wherein the glass particles have a glass composition comprising:
at least one donor element-containing compound selected from the group consisting of P 2 O 3 , P 2 O 5 , and Sb 2 O 3 ; and at least one glass-forming compound selected from the group consisting of SiO 2 , K 2 O, Na 2 O, Li 2 O, BaO, SrO, CaO, MgO, BeO, ZnO, PbO, CdO, V 2 O 5 , SnO, ZrO 2 , and MoO 3 .
12 . The improvement of claim 11 , wherein the glass composition contains from about 29% to about 85%, by mass, of the donor element-containing compound.
13 . The improvement of claim 11 , wherein the glass composition contains from about 29% to about 85%, by mass, of P 2 O 5 .
14 . The improvement of claim 11 , wherein the glass composition contains from about 0.1% to about 95%, by mass, of the glass-forming compound.
15 . The improvement of claim 14 , wherein the glass composition contains from about 0.5% to about 90%, by mass, of the glass-forming compound.
16 . The improvement of claim 11 , wherein the glass composition contains not more than about 50%, by mass, of V 2 O 5 .
17 . The improvement of claim 16 , wherein the glass composition contains from about 1% to about 50%, by mass, of V 2 O 5 .
18 . The improvement of claim 17 , wherein the glass composition contains from about 3% to about 40%, by mass, of V 2 O 5 .
19 . The improvement of claim 11 , wherein the glass composition is substantially devoid of V 2 O 5 .
20 . The improvement of claim 1 , wherein the glass particles have a softening temperature in a range from about 200° C. to about 1000° C.
21 . The improvement of claim 1 , wherein the glass particles have a softening temperature in a range from about 300° C. to about 900° C.
22 . The improvement of claim 1 , wherein the glass particles have a particle diameter not greater than about 100 micrometers.
23 . The improvement of claim 1 , wherein the glass particles have a particle diameter not greater than about 50 micrometers.
24 . The improvement of claim 1 , wherein the spreadable paste medium comprises a binder and a solvent for the binder.
25 . The improvement of claim 24 , wherein the binder comprises at least one natural or synthetic organic polymer.
26 . The improvement of claim 24 , wherein the binder comprises ethylcellulose.
27 . The improvement of claim 24 , wherein the solvent is a solvent volatile in a temperature range from about 80° C. to about 300° C.
28 . The improvement of claim 1 , wherein the glass particles constitute from about 0.1%, by mass, to about 95%, by mass, of the paste composition.
29 . The improvement of claim 1 , wherein the glass particles constitute from about 1%, by mass, to about 90%, by mass, of the paste composition.
30 . The improvement of claim 1 , further comprising particles of a metal capable of promoting crystallization of the glass.
31 . The improvement of claim 30 , wherein the metal is selected from the group consisting of silver, silicon, copper, iron, zinc, and manganese.
32 . The improvement of claim 30 , wherein the metal is selected from the group consisting of silver, silicon, and zinc.Join the waitlist — get patent alerts
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