Selectively adjustable cardiac valve implants
Abstract
Methods and devices are provided for support of a body structure. The devices can be adjusted within the body of a patient in a minimally invasive or non-invasive manner such as by applying energy percutaneously or external to the patient's body. The energy may include, for example, acoustic energy, radio frequency energy, light energy and magnetic energy. Thus, as the body structure changes size and/or shape, the size and/or shape of the annuloplasty rings can be adjusted to provide continued reinforcement. In certain embodiments, the devices include a first body member including a first shape memory material configured to transform the annuloplasty ring from a first configuration having a first size of a dimension to a second configuration having a second size of the dimension. The second size is less than said first size in septal lateral distance. The devices also include a second body member including a second shape memory material configured to transform the annuloplasty ring from the second configuration to a third configuration having a third size of the dimension, wherein the second size is less than the third size in septal lateral distance.
Claims
exact text as granted — not AI-modified1 . An adjustable annuloplasty ring comprising:
a first shape memory member configured to transform said annuloplasty ring from a first configuration having a first size of a ring dimension to a second configuration having a second size of the ring dimension, wherein said second size is less than said first size; and a second shape memory member configured to transform said annuloplasty ring from said second configuration to a third configuration having a third size of the ring dimension, wherein said second size is less than said third size.
2 . The adjustable annuloplasty ring of claim 1 , wherein said first shape memory member is configured to change shape in response to being heated to a first temperature, and wherein said second shape memory member is configured to change shape in response to being heated to a second temperature.
3 . The adjustable annuloplasty ring of claim 2 , wherein said first temperature is lower than said second temperature.
4 . The adjustable annuloplasty ring of claim 2 , wherein said second temperature is lower than said first temperature.
5 . The adjustable annuloplasty ring of claim 2 , wherein at least one of said first shape memory member and said second shape memory member comprises at least one of a metal, a metal alloy, a nickel titanium alloy, a shape memory polymer, polylactic acid, and polyglycolic acid.
6 . The adjustable annuloplasty ring of claim 1 , wherein at least one of said first shape memory member and said second shape memory member is configured to change shape in response to a magnetic field.
7 . The adjustable annuloplasty ring of claim 6 , wherein at least one of said first shape memory member and said second shape memory member comprises at least one of Fe—C, Fe—Pd, Fe—Mn—Si, Co—Mn, Fe—Co—Ni—Ti, Ni—Mn—Ga, Ni 2 MnGa, and Co—Ni—Al.
8 . The adjustable annuloplasty ring of claim 1 , wherein said ring dimension is a septolateral dimension.
9 . An adjustable annuloplasty ring comprising:
a first shape memory member configured to transform said annuloplasty ring from a first configuration having a first size of a ring dimension to a second configuration having a second size of the ring dimension, wherein said second size is less than said first size; and a second shape memory member configured to transform said annuloplasty ring from said second size to a third size of the ring dimension, wherein said third size is less than said second size.
10 . The adjustable annuloplasty ring of claim 9 , wherein said first shape memory member is configured to change shape in response to being heated to a first temperature, and wherein said second shape memory member is configured to change shape in response to being heated to a second temperature.
11 . The adjustable annuloplasty ring of claim 10 , wherein said first temperature is lower than said second temperature.
12 . The adjustable annuloplasty ring of claim 10 , wherein said second temperature is lower than said first temperature.
13 . The adjustable annuloplasty ring of claim 10 , wherein at least one of said first shape memory member and said second shape memory member comprises at least one of a metal, a metal alloy, a nickel titanium alloy, a shape memory polymer, polylactic acid, and polyglycolic acid.
14 . The adjustable annuloplasty ring of claim 9 , wherein at least one of said first shape memory member and said second shape memory member is configured to change shape in response to a magnetic field.
15 . The adjustable annuloplasty ring of claim 14 , wherein at least one of said first shape memory member and said second shape memory member comprises at least one of Fe—C, Fe—Pd, Fe—Mn—Si, Co—Mn, Fe—Co—Ni—Ti, Ni—Mn—Ga, Ni 2 MnGa, and Co—Ni—Al.
16 . The adjustable annuloplasty ring of claim 9 , wherein said ring dimension is a septolateral dimension.
17 . An adjustable annuloplasty ring comprising:
a first shape memory member configured to transform said annuloplasty ring from a first configuration having a first size of a ring dimension to a second configuration having a second size of the ring dimension, wherein said first size is less than said second size; and a second shape memory member configured to transform said annuloplasty ring from said second configuration to a third configuration having a third size of the ring dimension, wherein said third size is less than said second size.
18 . The adjustable annuloplasty ring of claim 17 , wherein said first shape memory member is configured to change shape in response to being heated to a first temperature, and wherein said second shape memory member is configured to change shape in response to being heated to a second temperature.
19 . The adjustable annuloplasty ring of claim 18 , wherein said first temperature is lower than said second temperature.
20 . The adjustable annuloplasty ring of claim 18 , wherein said second temperature is lower than said first temperature.Join the waitlist — get patent alerts
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