Copper alloy material

Abstract

A copper alloy material, containing Ni 1.8 to 5.0 mass % and Si 0.3 to 1.7 mass %, at a ratio of contents of Ni and Si, Ni/Si, of 3.0 to 6.0, and having a content of S of less than 0.005 mass %, with the balance of being Cu and inevitable impurities, wherein the copper alloy material satisfies formulae (1) to (4): 130× C +300≦ TS ≦130×C+650  (1) 0.001≦d≦0.020  (2) W≦150  (3) 10≦L≦800  (4) wherein TS represents a tensile strength (MPa) of the copper alloy material in a direction parallel to rolling; C represents the content (mass %) of Ni in the copper alloy material; d represents an average grain diameter (mm) of the copper alloy material; W represents a width (nm) of a precipitate free zone; and L represents a particle diameter (nm) of a compound on a grain boundary.

1 . A method of producing a copper alloy material comprising Ni 1.8 to 5.0 mass % and S 0.3 to 1.7 mass %, at a ratio of contents of Ni and Si, Ni/Si, of 3.0 to 6.0, and having a content of S of less than 0.005 mass %, with the balance of being Cu and inevitable impurities, wherein the copper alloy material satisfies the following formulae (1) to (4):
   130× C +30≦ TS≦ 130× C+ 650  (1)
     0.001≦d≦0.020  (2)
     W≦150  (3)
     10≦L≦800  (4)
   
       wherein TS represents a tensile strength (MPa) of the copper alloy material in a direction parallel to rolling (LD); C represents the content (mass %) of Ni in the copper alloy material; d represents an average grain diameter (mm) of the copper alloy material; W represents a width (nm) of a precipitate free zone (PFZ); and L represents a particle diameter (nm) of a compound on a grain boundary, said method comprising:
 conducting a first aging treatment at a temperature in the range 350 to 450° C.; and 
 conducting a second aging treatment at a temperature in the range 450 to 600° C.