Heat dissipation structure

Abstract

A heat dissipation structure includes a substrate, an electronic component mounted on the substrate, a heat dissipation member for dissipating heat generated from the electronic component, and a thermal conductive adhesive sheet provided on the substrate so as to cover the electronic component. The thermal conductive adhesive sheet includes a thermal conductive layer containing a plate-like boron nitride particle. The thermal conductive layer has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive layer of 4 W/m·K or more, and the thermal conductive adhesive sheet is in contact with the heat dissipation member.

1 . A heat dissipation structure comprising:
 a substrate,   an electronic component mounted on the substrate,   a heat dissipation member for dissipating heat generated from the electronic component, and   a thermal conductive adhesive sheet provided on the substrate so as to cover the electronic component,   wherein the thermal conductive adhesive sheet includes a thermal conductive layer containing a plate-like boron nitride particle,   the thermal conductive layer has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive layer of 4 W/m·K or more, and   the thermal conductive adhesive sheet is in contact with the heat dissipation member.   
     
     
         2 . The heat dissipation structure according to  claim 1 , wherein the thermal conductive adhesive sheet includes an adhesive layer or a pressure-sensitive adhesive layer laminated onto at least one face of the thermal conductive layer, and
 the adhesive layer or the pressure-sensitive adhesive layer is adhered to or pressure-sensitively adhered to the substrate.