US2011259567A1PendingUtilityA1

Thermal conductive sheet

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Assignee: NITTO DENKO CORPPriority: Jan 29, 2010Filed: Jan 28, 2011Published: Oct 27, 2011
Est. expiryJan 29, 2030(~3.5 yrs left)· nominal 20-yr term from priority
B32B 37/10C09K 5/14B32B 2307/302C08J 5/18C08K 7/18C08K 2003/382C08K 3/38B32B 2457/20
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Claims

Abstract

A thermal conductive sheet includes a plate-like boron nitride particle. The thermal conductive sheet has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet of 4 W/m·K or more, and the 5% weight loss temperature of 250° C. or more. The thermal conductive sheet has a water absorption of 3 vol % or less.

Claims

exact text as granted — not AI-modified
1 . A thermal conductive sheet comprising a plate-like boron nitride particle, wherein
 the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more, and   the 5% weight loss temperature is 250° C. or more.   
     
     
         2 . A thermal conductive sheet comprising a plate-like boron nitride particle, wherein
 the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more, and   the water absorption is 3 vol % or less.

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