Composite Materials With Improved Performance

Abstract

A composite material comprising at least one polymeric resin and optionally at least one fibrous reinforcement where the polymeric resin comprises at least one difunctional epoxy resin and at least one epoxy resin with a functionality greater than two having at least one meta-substituted phenyl ring in its backbone.

1 . A resin composition which is curable at a curing temperature, wherein the resin composition comprises:
 from 10 to 40 weight percent, based on the overall resin composition, of difunctional epoxy resin;   from 10 to 40 weight percent, based on the overall resin composition, of triglycidyl-m-aminophenol;   from 5 to 20 weight percent, based on the overall resin composition, of insoluble thermoplastic particles;   from 5 to 25 weight percent, based on the overall resin composition, of thermoplastic toughening agent; and   a sufficient amount of a curing agent to provide curing of said resin composition at said curing temperature.   
     
     
         2 . A resin composition according to  claim 1  wherein said difunctional epoxy resin is selected from the group consisting of diglycidyl ether of bisphenol F, diglycidyl ether of bisphenol A, diglycidyl dihydroxy naphthalene and combinations thereof. 
     
     
         3 . A resin composition according to  claim 2  wherein the curing agent comprises 4,4′-diaminodiphenyl sulphone and/or 3,3′-diaminodiphenyl sulphone. 
     
     
         4 . A resin composition according to  claim 1  wherein said insoluble thermoplastic particles comprise polyamide. 
     
     
         5 . A resin composition according to  claim 1  wherein said thermoplastic toughening agent comprises polyethersulfone. 
     
     
         6 . A resin composition according to  claim 5  wherein said insoluble thermoplastic particles comprise polyamide. 
     
     
         7 . A resin composition according to  claim 2  wherein said insoluble thermoplastic particles comprise polyamide. 
     
     
         8 . A resin composition according to  claim 7  wherein said thermoplastic toughening agent comprises polyethersulfone. 
     
     
         9 . A resin composition according to  claim 1  wherein said resin composition further comprises at least one additional ingredient selected from flexibilisers, accelerators, thermoplastic polymers, core shell rubbers, flame retardants, wetting agents, pigment/dyes, ultra-violet absorbers, anti-fungal compounds, fillers and conducting particles. 
     
     
         10 . A resin composition according to  claim 9  wherein said conducting particles are selected from: silver, gold, copper, aluminum, nickel, conducting grades of carbon, buckminsterfullerene, carbon nanotubes, carbon nanofibers, nickel coated carbon particles and silver coated copper particles. 
     
     
         11 . A method of making a composite material comprising the steps of:
 providing a resin composition according to  claim 1  and at least one fibrous reinforcement; and   applying said resin composition to said fibrous reinforcement.   
     
     
         12 . A method according to  claim 11  wherein said difunctional epoxy resin is selected from the group consisting of diglycidyl ether of bisphenol F, diglycidyl ether of bisphenol A, diglycidyl dihydroxy naphthalene and combinations thereof. 
     
     
         13 . A method according to  claim 12  wherein the curing agent comprises 4,4′-diaminodiphenyl sulphone and/or 3,3′-diaminodiphenyl sulphone. 
     
     
         14 . A method according to  claim 11  wherein said insoluble thermoplastic particles comprise polyamide. 
     
     
         15 . A method according to  claim 11  wherein said thermoplastic toughening agent comprises polyethersulfone. 
     
     
         16 . A method according to  claim 11  wherein said resin composition further comprises at least one additional ingredient selected from flexibilisers, accelerators, thermoplastic polymers, core shell rubbers, flame retardants, wetting agents, pigment/dyes, ultra-violet absorbers, anti-fungal compounds, fillers and conducting particles. 
     
     
         17 . A method according to  claim 16  wherein said conducting particles are selected from: silver, gold, copper, aluminum, nickel, conducting grades of carbon, buckminsterfullerene, carbon nanotubes, carbon nanofibers, nickel coated carbon particles and silver coated copper particles. 
     
     
         18 . A method according to  claim 11  which includes the step of curing said resin composition.