Light Emitting Diode Package Structure and Manufacturing Method Therefor

Abstract

A light emitting diode (LED) package and a manufacturing method therefor are disclosed. In one aspect, a manufacturing method of a light emitting diode package may: heat a first light transmission insulation material to cause the first light transmission insulation material to become a sticky member; connect a lead frame to the sticky member; perform a chip-bonding step that bonds at least one light-emitting diode chip on the sticky member using a light transmission glue; encapsulate the at least one light-emitting diode chip with a second light transmission insulation material; and perform a drying step that forms the sticky member and the second light transmission insulation material into shape.

1 . A manufacturing method of a light emitting diode package, comprising:
 heating a first light transmission insulation material to cause the first light transmission insulation material to become a sticky member;   connecting a lead frame to the sticky member;   performing a chip-bonding step that bonds at least one light-emitting diode chip on the sticky member using a light transmission glue;   encapsulating the at least one light-emitting diode chip with a second light transmission insulation material; and   performing a drying step that forms the sticky member and the second light transmission insulation material into shape.   
     
     
         2 . The manufacturing method as recited in  claim 1 , wherein the first light transmission insulation material comprises transparent epoxy or silicone. 
     
     
         3 . The manufacturing method as recited in  claim 1 , wherein the second light transmission insulation material comprises transparent epoxy or silicone. 
     
     
         4 . The manufacturing method as recited in  claim 1 , wherein the second light transmission insulation material and the first light transmission insulation material are formed from the same transparent material. 
     
     
         5 . The manufacturing method as recited in  claim 1 , further comprising:
 performing a solder resisting step that coats a solder mask on a bottom side of the lead frame.   
     
     
         6 . The manufacturing method as recited in  claim 1 , further comprising:
 performing a wire-bonding step or a bump-bonding step that electrically connects the at least one light-emitting diode chip to the lead frame.   
     
     
         7 . A manufacturing method of a light emitting diode package, comprising:
 heating a first light transmission insulation material to cause the first light transmission insulation material to become a sticky member;   connecting a lead frame to the sticky member;   performing a solder resisting step that coats a solder mask on a bottom side of the lead frame; and   performing a chip-bonding step that bonds at least one light-emitting diode chip on the sticky member using a light transmission glue.   
     
     
         8 . The manufacturing method as recited in  claim 7 , wherein the first light transmission insulation material comprises transparent epoxy or silicone. 
     
     
         9 . The manufacturing method as recited in  claim 7 , further comprising:
 encapsulating the at least one light-emitting diode chip with a second light transmission insulation material.   
     
     
         10 . The manufacturing method as recited in  claim 9 , wherein the second light transmission insulation material comprises transparent epoxy or silicone. 
     
     
         11 . The manufacturing method as recited in  claim 9 , wherein the second light transmission insulation material and the first light transmission insulation material are formed from the same transparent material. 
     
     
         12 . The manufacturing method as recited in  claim 9 , further comprising:
 performing a drying step that forms the sticky member and the second light transmission insulation material into shape.   
     
     
         13 . The manufacturing method as recited in  claim 7 , further comprising:
 performing a wire-bonding step or a bump-bonding step that electrically connects the at least one light-emitting diode chip to the lead frame.   
     
     
         14 . A light emitting diode package, comprising:
 a light transmission substrate having a central portion and a peripheral portion surrounding the central portion;   at least one light-emitting diode chip disposed on the central portion of the light transmission substrate;   a lead frame connecting the peripheral portion of the light transmission substrate, wherein the lead frame is electrically connected to the light-emitting diode chip; and   an encapsulant disposed on the light transparent substrate, wherein the encapsulant covers the at least one light-emitting diode chip and the lead frame.   
     
     
         15 . The light emitting diode package as recited in  claim 14 , wherein the light transmission substrate comprises transparent epoxy or silicone. 
     
     
         16 . The light emitting diode package as recited in  claim 14 , wherein the encapsulant comprises transparent epoxy or silicone. 
     
     
         17 . The light emitting diode package as recited in  claim 14 , wherein the encapsulant and the light transmission substrate are formed from the same material. 
     
     
         18 . The light emitting diode package as recited in  claim 14 , further comprising:
 a light transmission glue that bonds the at least one light-emitting diode chip on the light transmission substrate.   
     
     
         19 . The light emitting diode package as recited in  claim 14 , further comprising:
 a plurality of conducting wires or bumps electrically connecting the at least one light-emitting diode chip to the lead frame.   
     
     
         20 . The light emitting diode package as recited in  claim 14 , further comprising:
 a solder mask coated on a first side of the lead frame opposite from a second side of the lead frame that is on a same side of the light transmission substrate as the at least one light-emitting diode chip.