Substrate for an electrical device

Abstract

Substrate for electrical devices is disclosed. An embodiment for the substrate comprised of an insulator, a conductive element(s) and a conductive material(s), wherein the conductive element embedded in the insulator, and two surfaces of the conductive element exposed to two surfaces of the insulator for electrical connection respectively, wherein the upper surface of conductive element is below the upper surface of insulator and is plated by the conductive material, meanwhile the conductive element include a protruding portion which is protruded the insulator, in this manner, solder balls are not needed, moreover the conductive element can further include an extending portion; the present invention may be capable of affording a thinner electrical device thickness and enhanced reliability.

1 . A substrate for electrical device, comprising:
 at least a first conductive element having at least a first upper surface, a first lower surface, a first side edge, a protruding portion and an extending portion, wherein said extending portion being common unitary with said protruding portion, and said protruding portion being common unitary with said first conductive element, in this manner, said first conductive element associated with both said protruding portion and said extending portion being common unitary; and   at least an insulator having at least a first upper surface, a first lower surface and a side wall; said first conductive element encapsulated by said insulator and embedded therein, in this manner, said first side edge of said first conductive element being encapsulated by said insulator, wherein said protruding portion being protruded and exposed to the first lower surface of said insulator, said extending portion extended from said protruding portion and coupled with said first lower surface of insulator, in this manner, said first lower surface of said first conductive element being protruded and exposed to the first lower surface of said insulator too; and wherein said first upper surface of said first conductive element being protruded and exposed to said first upper surface of said insulator.   
     
     
         2 . The substrate of  claim 1 , further comprising at least a conductive material, wherein at least a portion of said first conductive element being plated by said conductive material. 
     
     
         3 . The substrate of  claim 2 , further comprising at least an another conductive material; wherein said conductive material being plated by said another conductive material. 
     
     
         4 . The substrate of  claim 1 , wherein said insulator further comprising at least a through hole. 
     
     
         5 . The substrate of  claim 1 , further comprising: at least an another insulator which is situated on the first lower surface of insulator. 
     
     
         6 . The substrate of  claim 5 , wherein at least a portion of said extending portion of said first conductive element being coupled with said another insulator. 
     
     
         7 . A substrate for electrical device, comprising:
 at least a first conductive element having at least a first upper surface, a first lower surface, a first side edge, a protruding portion and an extending portion, wherein said extending portion being common unitary with said protruding portion, and said protruding portion being common unitary with said first conductive element, in this manner, said first conductive element associated with both said protruding portion and said extending portion being common unitary; and   at least an insulator having at least a first upper surface, a first lower surface and a side wall; said first conductive element encapsulated by said insulator and embedded therein, in this manner, said first side edge of said first conductive element being encapsulated by said insulator, wherein said protruding portion being protruded and exposed to the first lower surface of said insulator, said extending portion extended from said protruding portion and coupled with said first lower surface of insulator, in this manner, said first lower surface of said first conductive element being protruded and exposed to the first lower surface of said insulator too; and wherein said first upper surface of said first conductive element being co-planar with said first upper surface of said insulator.   
     
     
         8 . The substrate of  claim 7 , further comprising at least a conductive material, wherein at least a portion of said first conductive element being plated by said conductive material. 
     
     
         9 . The substrate of  claim 8 , further comprising at least an another conductive material; wherein said conductive material being plated by said another conductive material. 
     
     
         10 . The substrate of  claim 7 , wherein said insulator further comprising at least a through hole. 
     
     
         11 . The substrate of  claim 7 , further comprising: at least an another insulator which is situated on the first lower surface of insulator. 
     
     
         12 . The substrate of  claim 11 , wherein at least a portion of said extending portion of said first conductive element being coupled with said another insulator.