Semiconductor Components Having Conductive Vias With Aligned Back Side Conductors

Abstract

A semiconductor component includes a semiconductor substrate, conductive vias in the substrate having terminal portions, a polymer layer on the substrate and back side conductors formed by the terminal portions of the conductive vias embedded in the polymer layer. A stacked semiconductor component includes a plurality of components having aligned conductive vias in electrical communication with one another.

1 . A semiconductor component comprising:
 a semiconductor substrate having a circuit side and a back side;   a plurality of conductive vias in the substrate, each conductive via comprising a via, an insulating layer in the via and a metal filling the via;   a polymer layer on the back side; and   a plurality of back side conductors comprising terminal portions of the conductive vias embedded in the polymer layer.   
     
     
         2 . The semiconductor component of  claim 1  wherein the conductors comprise planarized contactors. 
     
     
         3 . The semiconductor component of  claim 1  further comprising a plurality of terminal contacts on the conductors. 
     
     
         4 . The semiconductor component of  claim 1  further comprising a plurality of back side redistribution conductors on the polymer layer in electrical contact with the terminal portions. 
     
     
         5 . The semiconductor component of  claim 1  wherein the terminal portions have a height of from 5-10 μm. 
     
     
         6 . A stacked semiconductor component comprising:
 a plurality of semiconductor components in a stacked array, each component comprising:   a semiconductor substrate having a circuit side and a back side;   a plurality of conductive vias in the substrate, each conductive via comprising a via, an insulating layer in the via and a metal filling the via;   a polymer layer on the back side; and   a plurality of back side conductors comprising terminal portions of the conductive vias embedded in the polymer layer;   the components stacked back side to circuit side with the conductive vias in alignment.   
     
     
         7 . The stacked component of  claim 6  wherein each component comprises a plurality of terminal contacts bonded to the conductive vias on the component and to the conductive vias on an adjacent component. 
     
     
         8 . The stacked component of  claim 6  wherein the conductors include planarized contactors and terminal contacts on the contactors. 
     
     
         9 . The stacked component of  claim 6  further comprising a module substrate supporting the stacked array. 
     
     
         10 . The stacked component of  claim 6  wherein the components include a first component and a second component having a plurality of terminal contacts bonded to the conductive vias on the first component.