Method for producing a flexible circuit configuration

Abstract

A method is specified for the production of a flexible circuit configuration, which allows the manufacturing of such flexible circuits on a carrier film cost-effectively and with high precision. For this purpose, the carrier film is fastened at the beginning of the method on a rigid frame, which encloses an inner area, and spans the inner area using an inner surface. After finishing of a layer structure and optionally additional method steps, structures for flexible circuit configurations which are created over the inner surface may be cut out easily by cutting the flexible circuit configurations out of the inner surface as a cutout. Through the fastening of the carrier film on the frame, it is ensured during the various method steps of the production of the flexible circuit configuration that the carrier film, which is flexible per se, always forms a level foundation for the various method measures, in particular the photolithographic structuring of layers of a layer structure.

1 . A method for producing a flexible circuit configuration, a layer structure having at least one structured conductive layer being deposited over an underlay, characterized in that a flexible carrier film is used as the underlay, the carrier film is connected to a dimensionally-stable frame, which encloses an inner area, before deposition of the layer structure, the carrier film being connected to the frame using an edge area and spanning the inner area using an inner surface, the layer structure is created over the inner surface, and the flexible circuit configuration is cut out as a planar part of the composite of the first film having the layer structure from the inner surface. 
     
     
         2 . The method according to  claim 1 , wherein the carrier film is glued to the frame. 
     
     
         3 . The method according to  claim 1 , wherein the carrier film is connected to the frame under elastic tension. 
     
     
         4 . The method according to  claim 1 , wherein the carrier film comprises a polymer, in particular a polyimide. 
     
     
         5 . The method according to  claim 1 , wherein at least one insulating layer is deposited in the layer structure in addition to the at least one structured conductive layer. 
     
     
         6 . The method according to  claim 1 , wherein a layer structure is only created on one side, in particular the side of the carrier film facing away from the frame. 
     
     
         7 . The method according to  claim 1 , wherein a layer structure having at least one structured conductor film is created in each case on both sides of the carrier film. 
     
     
         8 . The method according to  claim 1 , wherein openings are created through the carrier film up to the at least one structured conductive layer. 
     
     
         9 . The method according to  claim 8 , wherein through contacts are created through the openings up to at least one conductive layer of the layer structure. 
     
     
         10 . The method according to  claim 1 , wherein a further film is fastened as a cover film on the side of the layer structure facing away from the carrier film. 
     
     
         11 . The method according to  claim 10 , wherein openings are created in the cover film which is fastened on the layer structure. 
     
     
         12 . The method according to  claim 11 , wherein through contacts are created through the openings of the cover film up to at least one conductive layer. 
     
     
         13 . The method according to  claim 1 , wherein an inner part, which fills up the inner area, is laid in the inner area without connection to the carrier film during at least one method step and supports the carrier film. 
     
     
         14 . The method according to  claim 13 , wherein the inner part and the frame are produced from a smooth plate, in that the inner part is cut out of the plate. 
     
     
         15 . The method according to  claim 1 , wherein the frame comprises metal, in particular stainless steel. 
     
     
         16 . A manufacturing module in a method for producing a flexible circuit configuration, which has a layer structure having at least one structured conductive layer on a flexible carrier film, characterized in that the carrier film is fastened using an edge area on a frame and spans an inner area enclosed by the frame and the layer structure for the flexible circuit configuration lies on the carrier film over the inner area. 
     
     
         17 . The manufacturing module according to  claim 16 , wherein an inner part which can be laid in the inner area is part of the manufacturing module. 
     
     
         18 . The manufacturing module according to  claim 17 , wherein the frame and the inner part have the same thickness. 
     
     
         19 . The manufacturing module according to  claim 17 , wherein the frame and the inner part comprise the same material. 
     
     
         20 . The manufacturing module according to  claim 19 , wherein frame and inner part comprise stainless steel.