Heat dissipation system with a spray cooling device

Abstract

A heat dissipation system includes a cooling device, a condenser, a vapor conveying duct and a cooling liquid conveying duct. The cooling device includes a housing, and an orifice plate dividing an inner space of the housing into a liquid supply chamber and an evaporation chamber proximate to the heat source, and formed with multiple micro orifices each having a diameter ranging from 5 to 1000 micrometers. The condenser includes a fluid inlet, a condensing chamber and a fluid outlet. The vapor conveying duct connects a vapor outlet of the housing and the fluid inlet of the condenser. The cooling liquid conveying duct connects a cooling liquid inlet of the housing and a fluid outlet of the condenser.

1 . A heat dissipation system for dissipating heat from a heat source, said heat dissipation system comprising:
 a cooling device including a housing, and an orifice plate that divides an inner space of said housing into a liquid supply chamber and an evaporation chamber proximate to the heat source, said housing having a cooling liquid inlet communicated with said liquid supply chamber and adapted to permit a working fluid to flow into said liquid supply chamber, and a vapor outlet communicated with said evaporation chamber, said orifice plate having a plurality of micro orifices, each of which has a diameter ranging from 5 to 1000 micrometers;   a condenser including a fluid inlet, a condensing chamber and a fluid outlet;   a vapor conveying duct connected to said vapor outlet of said housing and said fluid inlet of said condenser; and   a cooling liquid conveying duct connected to said cooling liquid inlet of said housing and said fluid outlet of said condenser;   wherein said cooling device, said condenser, said vapor conveying duct and said cooling liquid conveying duct cooperate to form a closed circuit.   
     
     
         2 . The heat dissipation system as claimed in  claim 1 , wherein each of said micro orifices of said orifice plate has a liquid intaking end and a liquid ejecting end, each of said micro orifices tapering from said liquid intaking end to said liquid ejecting end. 
     
     
         3 . The heat dissipation system as claimed in  claim 2 , wherein said orifice plate of said cooling device is formed by electro-forming, laser processing, thermal pressure forming, or injection molding. 
     
     
         4 . The heat dissipation system as claimed in  claim 1 , wherein each of said micro orifices has a diameter ranging from 5 to 500 micrometers. 
     
     
         5 . The heat dissipation system as claimed in  claim 4 , wherein, each of said micro orifices has a diameter ranging from 10 and 200 micrometers. 
     
     
         6 . The heat dissipation system as claimed in  claim 1 , wherein said micro orifices are spaced from each other by a distance that ranges from 5 to 2000 micrometers. 
     
     
         7 . The heat dissipation system as claimed in  claim 1 , wherein said orifice plate has a thickness ranging from 20 to 300 micrometers. 
     
     
         8 . The heat dissipation system as claimed in  claim 1 , wherein said housing of said cooling device has an upper housing part defining said liquid supply chamber and a lower housing part defining said evaporation chamber and assembled to said upper housing part. 
     
     
         9 . The heat dissipation system as claimed in  claim 8 , wherein said lower housing part has an inner surface formed with microstructure for enhancing vaporization effect. 
     
     
         10 . The heat dissipation system as claimed in  claim 8 , wherein said cooling device further includes a plurality of flow guiding plates mounted on an inner surface of said upper housing part. 
     
     
         11 . The heat dissipation system as claimed in  claim 1 , wherein said condenser includes a chamber casing, and a plurality of fins connected to said chamber casing. 
     
     
         12 . The heat dissipation system as claimed in  claim 11 , wherein each of said fins is hollow and has an interior space communicated with an interior of said chamber casing, said chamber casing and said fins defining said condensing chamber. 
     
     
         13 . The heat dissipation system as claimed in  claim 12 , wherein said chamber casing of said cooling device has an inclined bottom side, said fluid outlet being formed at a lower part of said bottom side, said fluid inlet being higher than said fluid outlet. 
     
     
         14 . The heat dissipation system as claimed in  claim 12 , wherein said condenser further includes a fan adjacent to said fins. 
     
     
         15 . The heat dissipation system as claimed in  claim 12 , wherein said chamber casing and said fins have inner surfaces formed with microstructures to enhance a condensation effect. 
     
     
         16 . The heat dissipation system as claimed in  claim 1 , wherein said vapor conveying duct has an inner surface formed with microstructures that enhance a condensation effect. 
     
     
         17 . The heat dissipation system as claimed in  claim 1 , further comprising a fluid driving module that includes a pump connected to said closed circuit for drawing the working fluid. 
     
     
         18 . The heat dissipation system as claimed in  claim 17 , wherein said fluid driving module further includes a control valve inserted into said closed circuit for controlling the flow rate of the working fluid. 
     
     
         19 . The heat dissipation system as claimed in  claims 17 , further comprising a power and control module for supplying power and controlling the operation of said closed circuit. 
     
     
         20 . The heat dissipation system as claimed in  claim 19 , wherein said cooling device further includes a temperature sensing member for sensing a temperature of the heat source, said power and control module being connected to said temperature sensing member and controlling said fluid driving module based on the temperature sensed by said temperature sensing member. 
     
     
         21 . The heat dissipation system as claimed in  claims 19 , wherein said condenser further includes temperature sensing member for sensing a temperature in said condensing chamber and a pressure sensing member for sensing a pressure in said condensing chamber, said power and control module being connected to said temperature sensing member and said pressure sensing member, and controlling said fluid driving module based on the temperature sensed by said temperature sensing member and the pressure sensed by said pressure sensing member. 
     
     
         22 . A cooling device included in a heat dissipation system as claimed in  claim 1 , comprising: a housing, and an orifice plate dividing an inner space of said housing into a liquid supply chamber and an evaporation chamber proximate to a heat source, said housing having a cooling liquid inlet communicated with said liquid supply chamber and adapted to permit a working fluid to flow into said liquid supply chamber, and a vapor outlet communicated with said evaporation chamber, said orifice plate having a plurality of micro orifices, each of which has a diameter ranging from 5 to 1000 micrometers.