Led light pod with modular optics and heat dissipation structure

Abstract

Disclosed is a modular light emitting diode (LED) light pod having heat dissipation structures. A reflective optic plate, which may be made in various modular sizes and designs, having a plurality of recesses is seated on an LED board having a plurality of LEDs, such that the plurality of LEDs fit within the plurality optical recesses. The optical recesses serve to collimate light in a desirable manner based on predetermined dimensional ratios of the optical recesses. A heat dissipation system involves a heat sink housing acting in combination with a heat extraction plate having a plurality thermally conductive posts extending perpendicularly from a top and bottom surface, and a heat dissipation plate to create a thermally conductive path for moving heat away from the LED board when the light pod is in use.

1 - 24 . (canceled) 
     
     
         25 . A method of making a light fixture comprising:
 fabricating a first set of one or more pins configured to operably connect to a first surface of a heat extraction plate; and   fabricating a second set of one or more pins having a first portion configured to operably connect to the heat extraction plate and a second portion configured to operably connect to a heat dissipation plate.   
     
     
         26 . The method of  claim 25 , further comprising:
 fabricating a mold for making an optical plate having predetermined dimensions which will produce a particular optical pattern.   
     
     
         27 . The method of  claim 26 , further comprising:
 configuring the mold of the optical plate with one or more optical recesses having an upper aperture and a lower aperture and an inner wall oriented at a predetermined angle.   
     
     
         28 . The method of  claim 26 , wherein the fabricating of the mold for making the optical plate comprises:
 heating a metallized plastic to a liquid state;   introducing the metallized plastic into the mold; and   removing the metallized plastic after it has cooled.   
     
     
         29 . The method of  claim 27 , wherein the metallized plastic has a high reflectivity. 
     
     
         30 . The method of  claim 25 , wherein the first set of one or more pins is further fabricated to operably connect to an electrical board at a different portion than the heat extraction plate.