US2011285989A1PendingUtilityA1

Inspection apparatus and inspection method

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Assignee: YAMASHITA HIROYUKIPriority: Mar 28, 2007Filed: Aug 3, 2011Published: Nov 24, 2011
Est. expiryMar 28, 2027(~0.7 yrs left)· nominal 20-yr term from priority
H10P 72/0616G01N 2021/95615G01N 21/9503G01N 21/95607G01N 21/94G01N 21/9501
51
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Claims

Abstract

An inspection apparatus includes a wafer stage for carrying a wafer, an illumination module which irradiates an inspection beam on the wafer carried on the wafer stage, a detection module which detects scattering rays or reflection rays from the wafer on the wafer stage and outputs an image signal, a coordinates control module which stores information about the arrangement of individual inspection areas on the wafer, and an imperfect area recognition module which recognizes, on the basis of the inspection area arrangement information stored in the coordinates control module, an imperfect inspection area interfering with a wafer edge.

Claims

exact text as granted — not AI-modified
1 . An inspection apparatus comprising:
 a wafer stage for carrying a wafer;   an illumination module which irradiates an inspection beam on the wafer carried on said wafer stage;   a detection module which detects scattering rays or reflection rays from the wafer on said wafer stage and outputs an image signal;   a coordinates control module which stores information about the arrangement of individual inspection areas on said wafer; and   an imperfect area recognition module which recognizes, on the basis of the inspection area arrangement information stored in said coordinates control module, an imperfect inspection area interfering with a wafer edge.   
     
     
         2 - 17 . (canceled)

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