Connecting structure and adhesion method of pcb using anisotropic conductive film, and method for evaluating connecting condition using the same

Abstract

A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 μm due to dents formed by heat-compression.

1 . A connecting structure of printed circuit board comprising:
 first and second members adhered to each other using an anisotropic conductive film interposed therebetween, the anisotropic conductive film including an insulating adhesive and conductive particles dispersed therein,   wherein the first member has a flexible property relatively to the second member, and wherein, after the first and second members are adhered to each other by heat compression, a surface roughness value of dents formed on the surface of the first member is in the range of 0.1 to 5.0 μm.   
     
     
         2 . The connecting structure of printed circuit board of  claim 1 ,
 wherein the first member is a Flexible Printed Circuit.