Method and system for packaging mems devices with incorporated getter

Abstract

Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.

1 . A method of packaging an electromechanical device, comprising:
 providing a substrate with an electromechanical device formed thereon;   applying a curable adhesive on the substrate circumscribing the electromechanical device;   contacting a backplane with the curable adhesive to encapsulate the electromechanical device in a package structure formed by the substrate, the adhesive and the backplane; and   curing the adhesive to seal the package.   
     
     
         2 . The method of  claim 1 , wherein the cured adhesive seal includes a low permeation rate adhesive. 
     
     
         3 . The method of  claim 1 , wherein the electromechanical device includes a microelectromechanical (MEMS) device. 
     
     
         4 . The method of  claim 3 , wherein the MEMS device is formed into an array. 
     
     
         5 . The method of  claim 3 , wherein the MEMS device includes an interferometric modulator. 
     
     
         6 . The method of  claim 1 , wherein the substrate includes a transparent substrate. 
     
     
         7 . The method of  claim 6 , wherein the transparent substrate is formed of glass. 
     
     
         8 . The method of  claim 1  further comprising positioning a getter inside the package structure. 
     
     
         9 . The method of  claim 1  further comprising positioning a desiccant inside the package structure. 
     
     
         10 . An electromechanical systems device package, comprising:
 an electromechanical systems device formed on a substrate;   a curable adhesive positioned on the substrate circumscribing the electromechanical systems device; and   a backplane contacting the curable adhesive and encapsulating the electromechanical device in a package formed between the substrate, the curable adhesive and the backplane.   
     
     
         11 . The electromechanical systems device package of  claim 10 , wherein the curable adhesive is formed of a low outgassing material. 
     
     
         12 . The electromechanical systems device package of  claim 10 , wherein the substrate, the curable adhesive and the backplane form a hermetic seal. 
     
     
         13 . The electromechanical systems device package of  claim 10 , wherein the substrate includes a transparent substrate. 
     
     
         14 . The electromechanical systems device package of  claim 16 , wherein the transparent substrate is formed of glass. 
     
     
         15 . The electromechanical systems device package of  claim 10  further comprising a desiccant disposed inside the package. 
     
     
         16 . The electromechanical systems device package of  claim 10  further comprising a getter disposed inside the package. 
     
     
         17 . The electromechanical systems device package of  claim 10  further comprising a secondary seal in contact with the curable adhesive and formed of a hydrophobic material. 
     
     
         18 . An electromechanical systems device package, comprising:
 an electromechanical systems device formed on a substrate;   a backplane; and   a cured adhesive contacting and sealing the backplane to the substrate to form a package, wherein the package encapsulates the electromechanical systems device.   
     
     
         19 . The electromechanical systems device package of  claim 18 , wherein the electromechanical device includes a microelectromechanical (MEMS) device. 
     
     
         20 . The electromechanical systems device package of  claim 19 , wherein the MEMS device is formed into an array. 
     
     
         21 . The electromechanical systems device package of  claim 19 , wherein the MEMS device includes an interferometric modulator.