Method of making microelectronic package using integrated heat spreader stiffener panel and microelectronic package formed according to the method

Abstract

A method of making a microelectronic package, and a microelectronic package made according to the method. The method includes: bonding and thermally coupling a plurality of IC dies to an IHS panel to yield a die-carrying IHS panel; mounting the die-carrying IHS panel onto a substrate panel including a plurality of package substrates to yield a combination including the die-carrying IHS panel mounted to the substrate panel; and singulating the combination to yield a plurality of microelectronic packages, each of the packages including: an IHS component of the IHS panel, one of the plurality IC dies bonded and thermally coupled to said IHS component, and one of the plurality of package substrates, said IHS component and said one of the plurality of IC dies being mounted to said one of the plurality of package substrates to form said each of the packages.

1 . A microelectronic package comprising:
 a package substrate;   an IC die mounted to the substrate;   an IHS bonded and thermally coupled to the die such that the die is between the substrate and the IHS, the IHS being coextensive in its width and in its length with respect to the package substrate.   
     
     
         2 . The package of  claim 1 , further including an underfill material disposed between the package substrate and the IHS, the underfill material being coextensive in its width and in its length with respect to the IHS and to the package substrate. 
     
     
         3 . The package of  claim 1 , wherein the package does not include any residual flux between the IHS and the package substrate. 
     
     
         4 . The package of  claim 1 , the IHS is a flat component without any projections extending toward the package substrate.