Bonded glass cutting method, package manufacturing method, package, piezoelectric vibrator, oscillator, electronic device, and radio-controlled timepiece

Abstract

Provided is a bonded glass cutting method of cutting a bonded glass, in which a plurality of glass substrates is bonded together on bonding surfaces thereof through a bonding material, along an intended cutting line, the method including: a first laser irradiation step of emitting a first laser to irradiate a beam having the absorption wavelength of the bonding material along the intended cutting line to thereby delaminate the bonding material on the intended cutting line from the bonding surfaces; a second laser irradiation step of emitting a second laser to irradiate a beam having the absorption wavelength of the bonded glass along the intended cutting line to thereby form a groove on one surface of the bonded glass; and a cutting step of cutting the bonded glass along the intended cutting line by applying a breaking stress to the intended cutting line of the bonded glass.

1 . A bonded glass cutting method of cutting a bonded glass, in which a plurality of glass substrates is bonded together on bonding surfaces thereof through a bonding material, along an intended cutting line, the method comprising:
 a first laser irradiation step of emitting a first laser to irradiate a beam having the absorption wavelength of the bonding material along the intended cutting line to thereby delaminate the bonding material on the intended cutting line from the bonding surfaces;   a second laser irradiation step of emitting a second laser to irradiate a beam having the absorption wavelength of the bonded glass along the intended cutting line to thereby form a groove on one surface of the bonded glass; and   a cutting step of cutting the bonded glass along the intended cutting line by applying a breaking stress to the intended cutting line of the bonded glass.   
     
     
         2 . The bonded glass cutting method according to  claim 1 ,
 wherein the bonding material is made of a conductive metallic material,   wherein the bonded glass has the plurality of glass substrates of which the bonding surfaces are anodically bonded to each other, and   wherein in the first laser irradiation step, the wavelength of the first laser is set to 532 nm.   
     
     
         3 . The bonded glass cutting method according to  claim 1 ,
 wherein the glass substrate is formed of a soda-lime glass, and   wherein in the second laser irradiation step, the wavelength of the second laser is set to 266 nm.   
     
     
         4 . The bonded glass cutting method according to  claim 1 ,
 wherein in the cutting step, the breaking stress is applied along the groove from the other surface of the bonded glass.   
     
     
         5 . The bonded glass cutting method according to  claim 1 ,
 wherein the bonded glass is bonded by disposing the bonding material on only a part of the intended cutting line, and   wherein in the first laser irradiation step, the beam of the first laser is irradiated onto only the bonding material disposed on the intended cutting line.   
     
     
         6 . A method of manufacturing a package which includes a plurality of glass substrates bonded to each other through a bonding material, and a cavity formed at an inner side of the plurality of glass substrates, and which is capable of sealing an electronic component in the cavity,
 wherein the plurality of glass substrates is cut for each formation region of the package using the bonded glass cutting method according to  claim 1 .   
     
     
         7 . A package which includes a plurality of glass substrates bonded to each other through a bonding material, and a cavity formed at an inner side of the plurality of glass substrates, and in which an electronic component is sealed in the cavity,
 wherein the package is cut using the bonded glass cutting method according to  claim 1 , and   wherein a chamfered portion where the groove formed by the second laser is divided is provided on an outer peripheral portion of a surface of the package on a side where it is irradiated by the second laser.   
     
     
         8 . A piezoelectric vibrator in which a piezoelectric vibrating reed is airtightly sealed in the cavity of the package according to  claim 7 . 
     
     
         9 . An oscillator in which the piezoelectric vibrator according to  claim 8  is electrically connected to an integrated circuit as an oscillating piece. 
     
     
         10 . An electronic device in which the piezoelectric vibrator according to  claim 8  is electrically connected to a clock section. 
     
     
         11 . A radio-controlled timepiece in which the piezoelectric vibrator according to  claim 8  is electrically connected to a filter section.