Gas barrier substrate, package of organic electro-luminenscent device and packaging method thereof

Abstract

A gas barrier substrate including a first gas barrier layer, a substrate, and a second gas barrier layer is provided. The first gas barrier layer has a central bonding surface bonded with the substrate and a peripheral boding surface surrounding the central bonding surface. The second gas barrier layer entirely covers the substrate and the first gas barrier layer. The second gas barrier layer is bonded with the substrate and the peripheral boding surface of the first gas barrier layer, wherein a minimum distance from an edge of the substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer.

1 . A gas barrier substrate, comprising:
 a first gas barrier layer having a central bonding surface and a peripheral bonding surface which surrounds the central bonding surface;   a substrate bonded with the central bonding surface of the first gas barrier layer; and   a second gas barrier layer covering the substrate and the first gas barrier layer, wherein the second gas barrier layer is bonded with the substrate and the peripheral bonding surface of the first gas barrier layer, and a minimum distance from an edge of the substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer.   
     
     
         2 . The gas barrier substrate as claimed in  claim 1 , wherein the first gas barrier layer and the second gas barrier layer are each a flexible gas barrier layer, and the substrate is a flexible substrate. 
     
     
         3 . The gas barrier substrate as claimed in  claim 1 , wherein the substrate has a sidewall, and the sidewall is substantially perpendicular to the central bonding surface. 
     
     
         4 . The gas barrier substrate as claimed in  claim 1 , wherein the substrate has a tapered sidewall, and an acute angle is included between the tapered sidewall and the central bonding surface. 
     
     
         5 . The gas barrier substrate as claimed in  claim 1 , wherein the edge of the first gas barrier layer is substantially aligned with the edge of the second gas barrier layer. 
     
     
         6 . The gas barrier substrate as claimed in  claim 1 , wherein the first gas barrier layer comprises a silicon nitride layer. 
     
     
         7 . The gas barrier substrate as claimed in  claim 1 , wherein the first gas barrier layer comprises a stacked layer, and the stacked layer comprises at least one silicon nitride layer and at least one spin-on glass (SOG) layer. 
     
     
         8 . The gas barrier substrate as claimed in  claim 1 , wherein the second gas barrier layer comprises a silicon nitride layer. 
     
     
         9 . The gas barrier substrate as claimed in  claim 1 , wherein the second gas barrier layer comprises a stacked layer, and the stacked layer comprises at least one silicon nitride layer and at least one spin-on glass (SOG) layer. 
     
     
         10 . The gas barrier layer as claimed in  claim 1 , further comprising a lift-off layer disposed on the first gas barrier layer, wherein the lift-off layer and the substrate are respectively located at two sides of the first gas barrier layer. 
     
     
         11 . A fabricating method of a gas barrier substrate, comprising:
 forming a de-bonding layer on a carrier;   forming a lift-off layer on the carrier;   forming a first gas barrier layer on the lift-off layer, the first gas barrier layer having a central bonding surface and a peripheral bonding surface which surrounds the central bonding surface;   forming a substrate on the central bonding surface of the first gas barrier layerand bonding the substrate with the central bonding surface; and   forming a second gas barrier layer, covering the substrate and the first gas barrier layer, wherein the second gas barrier layer is bonded with the substrate and the peripheral bonding surface of the first gas barrier layer, and a minimum distance from an edge of the substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer.   
     
     
         12 . The fabricating method of the gas barrier substrate as claimed in  claim 11 , wherein a method of forming the substrate on the central bonding surface comprises:
 coating a material layer on the central bonding surface; and   curing the material layer to form the substrate.   
     
     
         13 . The fabricating method of the gas barrier substrate as claimed in  claim 11 , wherein a method of forming the substrate on the central bonding surface comprises:
 providing a pre-formed substrate and bonding the pre-formed substrate with the central bonding surface.   
     
     
         14 . The fabricating method of the gas barrier substrate as claimed in  claim 11 , wherein a method of forming the first gas barrier layer comprises:
 forming a silicon nitride layer on the lift-off layer.   
     
     
         15 . The fabricating method of the gas barrier substrate as claimed in  claim 11 , wherein a method of forming the first gas barrier layer comprises:
 forming a stacked layer on the lift-off layer, wherein the stacked layer comprises at least one silicon nitride layer and at least one spin-on glass layer.   
     
     
         16 . The fabricating method of the gas barrier substrate as claimed in  claim 11 , wherein a method of forming the second gas barrier layer comprises:
 forming a silicon nitride layer on the lift-off layer.   
     
     
         17 . The fabricating method of the gas barrier substrate as claimed in  claim 11 , wherein a method of forming the second gas barrier layer comprises:
 forming a stacked layer on the lift-off layer, wherein the stacked layer comprises at least one silicon nitride layer and at least one spin-on glass layer.   
     
     
         18 . The fabricating method of the gas barrier substrate as claimed in  claim 11 , further comprising cutting the de-bonding layer, the lift-off layer, the first gas barrier layer, and the second gas barrier layer, so that the lift-off layer is separated from the de-bonding layer. 
     
     
         19 . A package of an organic electro-luminescent device, comprising:
 a first gas barrier substrate, comprising:
 a first gas barrier layer having a first central bonding surface and a first peripheral bonding surface which surrounds the first central bonding surface; 
 a first substrate bonded with the first central bonding surface of the first gas barrier layer; and 
 a second gas barrier layer covering the first substrate and the first gas barrier layer, wherein the second gas barrier layer is bonded with the first substrate and the first peripheral bonding surface of the first gas barrier layer, and a minimum distance from an edge of the first substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer; 
   a second gas barrier substrate bonded with the first gas barrier substrate; and   an organic electro-luminescent device disposed between the first gas barrier substrate and the second gas barrier substrate.   
     
     
         20 . The package of the organic electro-luminescent device as claimed in  claim 19 , wherein the second gas barrier substrate comprises:
 a third gas barrier layer having a second central bonding surface and a second peripheral bonding surface which surrounds the second central bonding surface;   a second substrate bonded with the second central bonding surface of the third gas barrier layer, wherein the organic electro-luminescent device is disposed on the second substrate.   
     
     
         21 . The package of the organic electro-luminescent device as claimed in  claim 19 , wherein the second gas barrier substrate comprises:
 a third gas barrier layer having a second central bonding surface and a second peripheral bonding surface which surrounds the second central bonding surface;   a second substrate bonded with the second central bonding surface of the third gas barrier layer, wherein the organic electro-luminescent device is disposed on the second substrate; and   a fourth gas barrier layer covering the second substrate, the organic electro-luminescent device, and the third gas barrier layer, wherein the fourth gas barrier layer is bonded with the second substrate, the organic electro-luminescent device, and the second peripheral bonding surface of the third gas barrier layer, and a minimum distance from an edge of the second substrate to an edge of the third gas barrier layer is greater than a thickness of the third gas barrier layer.   
     
     
         22 . The package of the organic electro-luminescent device as claimed in  claim 19 , wherein the second gas barrier substrate comprises:
 a third gas barrier layer having a second central bonding surface and a second peripheral bonding surface which surrounds the second central bonding surface;   a second substrate bonded with the second central bonding surface of the third gas barrier layer; and   a fourth gas barrier layer covering the second substrate and the third gas barrier layer, wherein the fourth gas barrier layer is bonded with the second substrate and the second peripheral bonding surface of the third gas barrier layer, a minimum distance from an edge of the second substrate to an edge of the third gas barrier layer is greater than a thickness of the third gas barrier layer, and the organic electro-luminescent device is disposed on the fourth gas barrier layer.   
     
     
         23 . A packaging method of an organic electro-luminescent device, comprising:
 forming an organic electro-luminescent device on a first gas barrier substrate;   providing a second gas barrier substrate; and   bonding the first gas barrier substrate and the second gas barrier substrate, so that the organic electro-magnetic device is sealed between the first gas barrier substrate and the second gas barrier substrate, wherein at least one of the first gas barrier substrate and the second gas barrier substrate is fabricated by the fabricating method of the gas barrier substrate as claimed in  claim 11 .