Insole Comprising an Electronic Chip

Abstract

The present invention relates to an insole comprising an electronic chip. To impart improved wearing comfort to the wearer of a shoe equipped with the generic insole, it is provided according to the invention that a module encompassing the chip is removably embedded in the insole.

1 . Insole ( 1 ) comprising an electronic chip ( 2 ), wherein a module ( 10 ) encompassing the chip ( 2 ) is removably embedded in the insole ( 1 ). 
     
     
         2 . Insole ( 1 ) according to  claim 1 , characterized in that the module ( 10 ) is arranged in a receiving chamber ( 8 ) of the insole ( 1 ), the receiving chamber ( 6 ) comprising an access opening of variable shape and/or size. 
     
     
         3 . Insole ( 1 ) according to at least one of the preceding claims, characterized in that the insole ( 1 ) comprises a stiffening element ( 12 ) which forms the receiving chamber ( 8 ) at least in sections. 
     
     
         4 . Insole ( 1 ) according to at least one of the preceding claims, characterized in that the stiffening element ( 12 ) stiffens a heel portion ( 3 ) of the insole ( 1 ). 
     
     
         5 . Insole ( 1 ) according to at least one of the preceding claims, characterized in that the module ( 10 ) is arranged between the stiffening element ( 12 ) and an adjoining or surrounding portion of the insole ( 1 ) and preferably directly or indirectly contacts the stiffening element ( 12 ) and/or the adjoining or surrounding portion of the insole ( 1 ). 
     
     
         6 . Insole ( 1 ) according to at least one of the preceding claims, characterized in that the stiffening element ( 12 ) is formed of a more rigid material than the adjoining or surrounding portion of the insole ( 1 ). 
     
     
         7 . Insole ( 1 ) according to at least one of the preceding claims, characterized in that the stiffening element ( 12 ) is inserted in a recess ( 11 ) of the insole ( 1 ), preferably such that the stiffening element ( 12 ) substantially closes and/or fills, preferably completely closes and/or fills, the recess ( 11 ), with a surface of the stiffening element ( 12 ) ending preferably substantially flush with an adjoining or surrounding surface of the insole ( 1 ). 
     
     
         8 . Insole ( 1 ) according to at least one of the preceding claims, characterized in that the receiving chamber ( 8 ) comprises a closure ( 13 ) which is preferably formed by the stiffening element ( 12 ), the closure ( 13 ) being preferably a flexible flap which is cut free out of the material of the stiffening element ( 12 ). 
     
     
         9 . Insole ( 1 ) according to at least one of the preceding claims, characterized in that the module ( 10 ) substantially closes and/or fills, preferably completely closes and/or fills, the receiving chamber ( 8 ). 
     
     
         10 . Insole ( 1 ) according to at least one of the preceding claims, characterized in that the module ( 10 ) is insertable into and/or removable from the receiving chamber from the bottom side (B) of the insole ( 1 ). 
     
     
         11 . Insole ( 1 ) according to at least one of the preceding claims, characterized in that the chip ( 2 ) is arranged in a housing ( 15 ,  16 ) of the module ( 10 ) which is preferably reclosable in a watertight manner, the chip ( 2 ) protruding preferably at least in sections into a recess ( 17 ) in the housing wall. 
     
     
         12 . Insole ( 1 ) according to at least one of the preceding claims, characterized in that the stiffening element ( 12 ) is substantially flat and has an oval contour in its plane of extension. 
     
     
         13 . Insole ( 1 ) according to at least one of the preceding claims, characterized in that the module ( 10 ) is substantially flat and has a substantially egg-shaped contour in its plane of extension, the module ( 10 ) being preferably insertable in the receiving chamber ( 8 ) such that a thinner end ( 19 ) of the module ( 10 ) is oriented towards the ball portion ( 5 ) of the insole ( 1 ) and/or a thicker end of the module ( 10 ) is oriented towards the heel portion ( 5 ) of the insole ( 1 ). 
     
     
         14 . Insole ( 1 ) according to at least one of the preceding claims, characterized in that the module ( 10 ) is flattened in substantially wedge-shaped fashion towards at least one side. 
     
     
         15 . Insole ( 1 ) according to at least one of the preceding claims, characterized in that the insole ( 1 ) comprises an elevation ( 20 ) on the top side (A), a recess ( 11 ) for the stiffening element ( 12 ) being formed on the bottom side (B) of the insole ( 1 ) in a corresponding position with respect to the elevation ( 20 ). 
     
     
         16 . Insole ( 1 ) according to at least one of the preceding claims, characterized in that the stiffening element ( 12 ) is adhesively connected to an adjoining or surrounding portion of the insole ( 1 ). 
     
     
         17 . Insole ( 1 ) according to at least one of the preceding claims, characterized in that the chip ( 2 ) is formed as an active or passive transponder chip and can be in wireless communication with a receiver, which is preferably integrated into a wrist watch. 
     
     
         18 . Insole ( 1 ) according to at least one of the preceding claims, which is configured as an insole ( 1 ) for lawn sports shoes, preferably as an insole for football shoes.