Printed wiring board and method for manufacturing same

Abstract

A method for manufacturing a printed wiring board including providing a support member having a metal surface, securing a metal foil to the metal surface such that the metal foil is joined or bonded to a peripheral portion of the metal surface, forming a resin insulation layer on the metal foil secured on the metal surface, forming an opening for a via conductor in the resin insulation layer, forming a conductive circuit on the resin insulation layer, forming in the opening a via conductor electrically connecting the conductive circuit and the metal foil such that a laminated sheet body is formed, and cutting a portion of the laminated sheet body inside the peripheral portion of the metal surface of the support member such that the metal foil releases the portion of the laminated sheet body from the support member.

1 . A method for manufacturing a printed wiring board, comprising:
 providing a support member having a metal surface;   securing a metal foil to the metal surface such that the metal foil is joined or bonded to a peripheral portion of the metal surface;   forming a resin insulation layer on the metal foil secured on the metal surface;   forming an opening for a via conductor in the resin insulation layer;   forming a conductive circuit on the resin insulation layer;   forming in the opening a via conductor electrically connecting the conductive circuit and the metal foil such that a laminated sheet body is formed; and   cutting a portion of the laminated sheet body inside the peripheral portion of the metal surface of the support member such that the metal foil releases the portion of the laminated sheet body from the support member.   
     
     
         2 . The method for manufacturing a printed wiring board according to  claim 1 , wherein the securing comprises bonding the metal foil to the support member by ultrasonic bonding. 
     
     
         3 . The method for manufacturing a printed wiring board according to  claim 1 , wherein the support member is one of a metal plate, a plate member comprising a support base member, and a plate member comprising a support base member and a metal covering a surface of the support base member. 
     
     
         4 . The method for manufacturing a printed wiring board according to  claim 3 , wherein the support member is a plate member comprising a support base member and a metal covering a surface of the support base member, and the metal is a metal foil. 
     
     
         5 . The method for manufacturing a printed wiring board according to  claim 2 , wherein the support member is one of a metal plate, a plate member comprising a support base member, and a plate member comprising a support base member and a metal covering a surface of the support base member. 
     
     
         6 . The method for manufacturing a printed wiring board according to  claim 5 , wherein the support member is a plate member comprising a support base member and a metal covering a surface of the support base member, and the metal is a metal foil. 
     
     
         7 . The method for manufacturing a printed wiring board according to  claim 1 , wherein the support member is a copper-clad laminate. 
     
     
         8 . The method for manufacturing a printed wiring board according to  claim 1 , wherein the metal foil has a first surface and a second surface on an opposite side of the first surface, the first surface of the metal foil faces the support member, and the second surface of the metal foil is a matted surface on which the resin insulation layer is formed. 
     
     
         9 . The method for manufacturing a printed wiring board according to  claim 1 , wherein the support member has double-sided metal surfaces at least one of which forms the metal surface. 
     
     
         10 . The method for manufacturing a printed wiring board according to  claim 1 , wherein the support member has double-sided metal surfaces each of which forms the metal surface, the securing, the forming of the resin insulation layer, the forming of the opening, the forming of the opening, and the forming of the via conductor are carried out on the double-sided metal surfaces of the support member. 
     
     
         11 . The method for manufacturing a printed wiring board according to  claim 1 , wherein the support member has a single-sided metal surface forming the metal surface. 
     
     
         12 . The method for manufacturing a printed wiring board according to  claim 1 , wherein the securing comprises joining or bonding the metal foil to the metal surface at a plurality of positions along the peripheral portion of the metal surface. 
     
     
         13 . The method for manufacturing a printed wiring board according to  claim 1 , wherein the securing comprises joining or bonding the metal foil to the metal surface along the peripheral portion of the metal surface.