Fluid management system and method for fluid dispensing and coating

Abstract

A system and method are provided including a coating method and apparatus using a dielectrophoretic fluid movement system to coat with a non-conducting fluid along a surface that includes a non-conducting surface to receive the non-conducting fluid and a first and second array of one or more substantially parallel microelectrodes positioned on the surface, said first array having microelectrode(s) positioned between, and alternating with, the microelectrode(s) of the second array, forming an interleaved pattern as well as an electric power source in communication with the first array and second array so that the first array and second array interact to create a non-uniform electric field such that the non-conducting fluid moves parallel to the microelectrodes in response to the applied non-uniform electric field.

1 . A coating method for moving non-conducting fluid along a surface, the method comprising the steps of:
 a. applying a non-conducting fluid to a non-conducting surface including a first and second array of one or more substantially parallel microelectrodes positioned on said surface, said first array having microelectrode(s) positioned between, and alternating with, the microelectrode(s) of the second array, forming an interleaved pattern; and   b. applying electric power to the first array and second array so that the first array and second array interact to create a non-uniform electric field such that the non-conducting fluid moves parallel to the microelectrodes in response to the applied non-uniform electric field.   
     
     
         2 . The method of  claim 1 , wherein the power to the electrodes, comprising electrodes is controlled to stop and start fluid movement 
     
     
         3 . The method of  claim 1 , wherein the power to electrodes is controlled so that fluid moves in some regions of the array and the fluid is prevented from movement in other areas by the electrodes. 
     
     
         4 . The method of  claim 3 , wherein the ratio between the electrode spacing and an electrode width is between 2:1 and 3:1. 
     
     
         5 . The method of  claim 1 , wherein the microelectrodes have a non-conducting coating.