Plating method

Abstract

Disclosed is a plating method including: performing plating on a plating surface of a plating substrate with a cathode electrode contacting an area in an outer circumferential section of the plating substrate where the cathode electrode is to be contacted, the plating substrate being provided with a dummy plating area between the area where the cathode electrode is to be contacted and a product area on the plating surface of the plating substrate, by supplying a plating solution to the plating surface of the plating substrate and applying electric current between the cathode electrode and an anode electrode via the plating solution.

1 . A plating method comprising:
 performing plating on a plating surface of a plating substrate with a cathode electrode contacting an area in an outer circumferential section of the plating substrate where the cathode electrode is to be contacted, the plating substrate being provided with a dummy plating area between the area where the cathode electrode is to be contacted and a product area on the plating surface of the plating substrate, by supplying a plating solution to the plating surface of the plating substrate and applying electric current between the cathode electrode and an anode electrode via the plating solution.   
     
     
         2 . The plating method according to  claim 1 , wherein the shape of a dummy plating area is identical to a shape of an area where a plating film is formed in the product area. 
     
     
         3 . The plating method according to  claim 1 , wherein the shape of the dummy plating area is rectangular. 
     
     
         4 . The plating method according to  claim 1 , wherein the shape of a dummy plating area is a shape continuously surrounding a location where the cathode electrode is to be contacted. 
     
     
         5 . The plating method according to  claim 1 , wherein a shape of the dummy plating area is a shape surrounding the entire product area.