US2011318690A1PendingUtilityA1

Compound, resin and photoresist composition

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Assignee: YAMASHITA YUKOPriority: Jun 29, 2010Filed: Jun 24, 2011Published: Dec 29, 2011
Est. expiryJun 29, 2030(~4 yrs left)· nominal 20-yr term from priority
G03F 7/0046G03F 7/0045C07D 311/20C08F 220/301G03F 7/0397C08F 220/303C08F 220/20C07D 327/06C07D 311/06G03F 7/0047C07D 339/08
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Claims

Abstract

The present invention provides a compound represented by the formula (I): wherein R 1 represents a hydrogen atom or a methyl group, A 1 represents a single bond or *—(CH 2 ) m —CO—O— in which m represents an integer of 1 to 4 and * represents a binding position to —O—, B 1 represents —O— or —S—, B 2 represents —CH 2 —, —O— or —S— and W 1 represents an optionally substituted aromatic ring, a resin comprising a structural unit derived from the compound and a photoresist composition comprising the resin.

Claims

exact text as granted — not AI-modified
1 . A compound represented by the formula (I): 
       
         
           
           
               
               
           
         
         wherein R 1  represents a hydrogen atom or a methyl group, A 1  represents a single bond or *—(CH 2 ) m —CO—O— in which m represents an integer of 1 to 4 and * represents a binding position to —O—, B 1  represents —O— or —S—, B 2  represents —CH 2 —, —O— or —S— and W 1  represents an optionally substituted aromatic ring. 
       
     
     
         2 . A resin comprising a structural unit derived from the compound according to  claim 1 . 
     
     
         3 . A photoresist composition comprising the resin according to  claim 2 . 
     
     
         4 . The photoresist composition according to  claim 3 , wherein the photoresist composition further contains an acid generator. 
     
     
         5 . The photoresist composition according to  claim 3  or  4 , wherein the photoresist composition further contains a basic compound. 
     
     
         6 . A process for producing a photoresist pattern comprising the following steps (1) to (5):
 (1) a step of applying the photoresist composition according to any one of  claims 3  to  5  on a substrate,   (2) a step of forming a photoresist film by conducting drying,   (3) a step of exposing the photoresist film to radiation,   (4) a step of baking the exposed photoresist film, and   (5) a step of developing the baked photoresist film with an alkaline developer, thereby forming a photoresist pattern.

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