US2011319300A1PendingUtilityA1

Systems for Filling a Sample Array by Droplet Dragging

Assignee: HUNTER IANPriority: Jan 12, 1998Filed: Sep 9, 2011Published: Dec 29, 2011
Est. expiryJan 12, 2018(expired)· nominal 20-yr term from priority
Y10T436/11B01J 2219/00495B01L 9/523G01N 30/466B01L 2300/0829B01J 2219/00536G01N 35/00069B01L 3/5025B01J 2219/00533B01J 2219/00389B01J 2219/00351B01L 3/50255B01L 2400/022B01F 33/3021B01J 2219/00549B01J 2219/00686B01J 2219/0036B01L 3/0293Y10T436/25B01L 2300/0845B01J 2219/00319G01N 2035/00237B01L 3/0262B01J 2219/00423B01J 2219/0043B01J 2219/00585B01J 2219/005B01J 2219/00587B01J 19/0046B01J 2219/00387C40B 70/00B01J 2219/00648B01L 3/5085B01J 2219/00373C40B 60/14G01N 2035/1037B01L 3/50857B01L 2200/0642B01J 2219/00369B01J 2219/00511B01J 2219/00283B01J 2219/00596B01L 2300/0819G01N 30/82B01J 2219/00479B01J 2219/00317B01J 2219/00659Y10T83/0481B01F 33/30351G01N 30/6095Y10T436/2575Y10T436/25625
50
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A method and an array filling system for loading a plurality of disparate sample containers, the sample containers comprising an integral structure. Each receptacle is characterized by a hydrophilic surface, and the receptacles are separated by a hydrophobic surface. The system has a liquid transfer device capable of holding liquid and adapted for motion to cause sequential communication of liquid held in the liquid transfer device with successive receptacles of the array by dragging the liquid across the hydrophobic surface.

Claims

exact text as granted — not AI-modified
1 .- 8 . (canceled) 
     
     
         9 . A method of forming a through-hole array, comprising:
 providing a glass substrate comprising a first surface and an opposing second surface;   using a laser to form a plurality of through-holes extending from the first surface to the second surface;   wherein at least some of the through-holes have a volume of less than 100 nanoliters.   
     
     
         10 . The method of  claim 9 , wherein at least some of the through-holes have a volume of about 10-7 cm 3  or greater. 
     
     
         11 . The method of  claim 9 , further comprising loading at least some of the plurality of through-holes with a liquid by placing a drop proximal one of the surfaces and dragging the droplet across the proximal surface. 
     
     
         12 . A method of forming a through-hole array, comprising:
 providing a silicon substrate comprising a first surface and an opposing second surface;   using a laser to form a plurality of through-holes extending from the first surface to the second surface;   wherein at least some of the through-holes have a volume of less than 100 nanoliters.   
     
     
         13 . The method of  claim 12 , wherein at least some of the through-holes have a volume of about 10-7 cm 3  or greater. 
     
     
         14 . The method of  claim 12 , further comprising loading at least some of the plurality of through-holes with a liquid by placing a drop proximal one of the surfaces and dragging the droplet across the proximal surface. 
     
     
         15 . A through-hole array, comprising:
 a substrate comprising a first surface and an opposing second surface;   a plurality of through-holes extending from the first surface to the second surface, at least some of the through-holes having a volume of less than 100 nanoliters;   wherein the substrate comprises a glass material or a silicon material.   
     
     
         16 . The through-hole array of  claim 15 , wherein at least some of the through-holes have a volume of about 10-7 cm 3  or greater. 
     
     
         17 . The through-hole array of  claim 15 , wherein the substrate is a silicon wafer. 
     
     
         18 . The through-hole array of  claim 15 , wherein a volume of at least some of the through-holes varies with spatial location on the array. 
     
     
         19 . The through-hole array of  claim 15 , wherein a lateral dimension of at least some of the through-holes varies with spatial location on the array. 
     
     
         20 . The through-hole array of  claim 15 , wherein a thickness of at least a portion of substrate including at least some of the through-holes varies with spatial location on the array. 
     
     
         21 . A system for analyzing specified properties of a set of substances, the system comprising:
 a through-hole array according to  claim 15 ; and   a detector array comprising a two-dimensional array of pixels, the detector disposed such that at least some of the through-holes of the array of through-holes are imaged on different pixels of the array of pixel.

Join the waitlist — get patent alerts

Track US2011319300A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.