Heat dissipation device

Abstract

An exemplary heat dissipation device, configured for dissipating heat of an electronic component, includes a first heat sink and a second heat sink detachably mounted to a lateral side of the first heat sink. The first heat sink is attached to the electronic component. The second heat sink has a smaller size than the first heat sink.

1 . A heat dissipation device for dissipating heat of an electronic component, the heat dissipation device comprising:
 a first heat sink adapted for being attached to the electronic component; and   a second heat sink detachably mounted to a lateral side of the first heat sink, the second heat sink having a smaller size than the first heat sink.   
     
     
         2 . The heat dissipation device of  claim 1 , wherein the first heat sink comprises a first base plate and a plurality first heat dissipation fins extending from the first base plate, the second heat sink comprises a second base plate and a plurality of second heat dissipation fins extending from the second base plate, and the second base plate is mounted to the first base plate. 
     
     
         3 . The heat dissipation device of  claim 2 , wherein the first heat dissipation fins are parallel to each other, the second heat dissipation fins are parallel to each other, and the first heat dissipation fins are parallel to the second heat dissipation fins. 
     
     
         4 . The heat dissipation device of  claim 2 , wherein the first heat dissipation fins define a first top face, the second heat dissipation fins define a second top face, and the second top face is lower than or at the same level as the first top face. 
     
     
         5 . The heat dissipation device of  claim 2 , wherein a height of the second heat dissipation fins extending above the second base plate is less than that of the first heat dissipation fins extending above the first base plate. 
     
     
         6 . The heat dissipation device of  claim 5 , wherein the first base plate comprises a first fin disposition section and a first connecting section beside the fin disposition section, the second heat sink is mounted to the first connecting section of the first heat sink, and the first heat dissipation fins extend from the first fin disposition section of the first heat sink. 
     
     
         7 . The heat dissipation device of  claim 6 , wherein the second base plate comprises a second fin disposition section and a second connecting section beside the second fin disposition section, the second connecting section of the second heat sink is mounted to the first connecting section of the first heat sink, and the second heat dissipation fins extend from the second fin disposition section of the second heat sink. 
     
     
         8 . The heat dissipation device of  claim 7  further comprising another second heat sink, wherein the two second heat sinks are respectively mounted at two opposite lateral sides of the first heat sink. 
     
     
         9 . The heat dissipation device of  claim 7 , wherein the second connecting section of the second heat sink is superposed on the first connecting section of the first heat sink, and the second and first connecting sections are connected together by at least one detachable fastener. 
     
     
         10 . The heat dissipation device of  claim 9 , wherein a layer of thermal interface material is disposed between the second connecting section of the second heat sink and the first connecting section of the first heat sink. 
     
     
         11 . The heat dissipation device of  claim 7 , wherein the first heat sink and the second heat sink are respectively formed through aluminum extrusion. 
     
     
         12 . A heat dissipation device for dissipating heat of an electronic component, the heat dissipation device comprising:
 a first heat sink adapted for being thermally attached to the electronic component, the first heat sink defining a first top face; and   a second heat sink detachably mounted to a lateral side of the first heat sink, the second heat sink defining a second top face, the second top face being lower than or at the same level as the first top face.