Method of fabricating an electrochemical device using ultrafast pulsed laser deposition
Abstract
A method of fabricating a multi-layered thin film electrochemical device is provided. The method comprises: providing a first target material in a chamber; providing a substrate in the chamber; emitting a first intermittent laser beam directed at the first target material to generate a first plasma, wherein each pulse of the first intermittent laser beam has a pulse duration of about 20 fs to about 500 ps; depositing the first plasma on the substrate to form a first thin film; providing a second target material in the chamber; emitting a second intermittent laser beam directed at the second target material to generate a second plasma, wherein each pulse of the second intermittent laser beam has a pulse duration of about 20 fs to about 500 ps; and depositing the second plasma on or above the first thin film to form a second thin film.
Claims
exact text as granted — not AI-modified1 . A method of fabricating a multi-layered thin film electrochemical device, comprising:
providing a first target material in a chamber; providing a substrate in the chamber; emitting a first intermittent laser beam directed at the first target material to generate a first plasma, wherein each pulse of the first intermittent laser beam has a pulse duration of about 20 fs to about 500 ps; depositing the first plasma on the substrate to form a first thin film; providing a second target material in the chamber; emitting a second intermittent laser beam directed at the second target material to generate a second plasma, wherein each pulse of the second intermittent laser beam has a pulse duration of about 20 fs to about 500 ps; and depositing the second plasma on or above the first thin film to form a second thin film.
2 . The method of claim 1 , wherein each pulse of the first and second intermittent laser beams has a pulse duration of about 20 fs to about 300 ps.
3 . The method of claim 2 , wherein each pulse of the first and second intermittent laser beams has a pulse duration of about 50 fs to about 1000 fs.
4 . The method of claim 1 , wherein the first and second plasmas are substantially free of molten droplets and/or particulates having a size of about 1 μm or greater.
5 . The method of claim 1 , wherein the first thin film is an anode thin film or a cathode thin film.
6 . The method of claim 1 , wherein the second thin film is a solid electrolyte thin film.
7 . The method of claim 1 , wherein the substrate comprises a metal, silicon or a conductive polymer.
8 . The method of claim 1 , wherein the deposition temperature during the step of depositing the first plasma is about 20° C. to about 900° C.
9 . The method of claim 8 , wherein the deposition temperature during the step of depositing the first plasma is about 300° C. to about 500° C.
10 . The method of claim 1 , wherein the deposition temperature during the step of depositing the second plasma is about 20° C. to about 900° C.
11 . The method of claim 10 , wherein the deposition temperature during the step of depositing the second plasma is about 300° C. to about 500° C.
12 . The method of claim 1 , wherein the deposition temperature during the step of depositing the second plasma is below about 300° C.
13 . The method of claim 12 , wherein the deposition temperature during the step of depositing the second plasma is about 25° C. to about 140° C.
14 . The method of claim 1 , wherein the thickness of each of the first and second thin films is less than about 10 μm.
15 . The method of claim 1 , wherein each of the first and second thin films has an average surface roughness of less than about 500 nm RMS.
16 . The method of claim 15 , wherein each of the first and second thin films has an average surface roughness of less than about 50 nm RMS.
17 . The method of claim 1 , wherein the electrochemical device is selected from the group consisting of a solar cell, an electrochromic cell, a microfuel cell and a thin film battery.
18 . The method of claim 1 , further comprising a step of selecting a deposition temperature or temperatures at which the first and second plasmas are deposited to obtain a predetermined stoichiometry of the first and second thin films.
19 . The method of claim 1 , wherein the deposition temperature during the step of depositing the first and/or second plasmas is less than about 300° C.
20 . The method of claim 19 , wherein the deposition temperature during the step of depositing the first and/or second plasmas is about 25° C. to about 140° C.Cited by (0)
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