Method of manufacturing a liquid crystal device

Abstract

A wafer level method of manufacturing a liquid crystal optical device removes the need for a rigid barrier fillet while minimizing any risk of contamination of the liquid crystal. An uncured adhesive may be deposited on a bottom substrate and partially cured to form a liquid crystal barrier. After addition of the liquid crystal and a top substrate, the adhesive is fully cured to bond the substrate layers together. An uncured adhesive may be used together with the partially cured adhesive, and may be deposited separately or filled into an extracellular matrix surrounding a plurality of liquid crystal cells. The adhesive may be cured by a variety of means, including light that may be spatially modulated. One or both of the substrates may be deformed during assembly so as to create a structure with a lensing effect on light passing through the liquid crystal region.

1 . A method of manufacturing a liquid crystal device comprising:
 providing an uncured adhesive on a bottom substrate to act as a liquid crystal retaining barrier;   partially curing the adhesive on the bottom substrate;   providing liquid crystal on the substrate within a region adjacent to the retaining barrier;   placing a top substrate in opposition to the bottom substrate so as to contact the adhesive and at least partially enclose the liquid crystal; and   further curing the adhesive to bond together the top and bottom substrates.   
     
     
         2 . The method as claimed in  claim 1 , wherein partially curing the adhesive comprises partially curing a first portion of the adhesive that is adjacent to the liquid crystal region and curing to a significantly lesser degree a second portion of said adhesive further from the liquid crystal region than the first adhesive portion, and wherein further curing of the adhesive comprises further curing each of the first and second adhesive portions. 
     
     
         3 . The method claimed as in  claim 2  wherein the second adhesive portion is separated from the first portion by an open space. 
     
     
         4 . The method claimed in  claim 2  wherein placing the top substrate in opposition to the bottom substrate results in the complete enclosure of the liquid crystal between the top substrate, the bottom substrate and the first portion of the adhesive. 
     
     
         5 . The method claimed in  claim 3  wherein placing the top substrate in opposition to the bottom substrate causes an overflow of liquid crystal into the open space between the first and second adhesive portions. 
     
     
         6 . The method as claimed in  claim 1  further comprising fixing a spacing between the top substrate and the bottom substrate by holding the top substrate with respect to the bottom substrate at a desired distance while further curing the adhesive. 
     
     
         7 . The method as claimed in  claim 6  further comprising providing spacers between the top and bottom substrates so as to fix a spacing therebetween. 
     
     
         8 . The method as claimed in  claim 1 , wherein said adhesive is light curable. 
     
     
         9 . The method as claimed in  claim 8  wherein partially curing said adhesive comprises partially curing said adhesive using spatially modulated light. 
     
     
         10 . The method as claimed in  claim 9  wherein partially curing said adhesive comprises partially curing said adhesive using light passing through a mask. 
     
     
         11 . The method as claimed in  claim 9  wherein partially curing said adhesive comprises partially curing said adhesive using a light source that directs light toward a first portion of the adhesive that is adjacent to the liquid crystal region. 
     
     
         12 . A method of manufacturing a liquid crystal device comprising:
 providing an uncured adhesive on a bottom substrate to act as a liquid crystal retaining barrier;   maintaining the adhesive on the bottom substrate at a temperature below ambient temperature;   providing liquid crystal on the substrate within a region adjacent to the retaining barrier;   placing a top substrate in opposition to the bottom substrate so as to contact the adhesive and enclose the liquid crystal; and   curing the adhesive to bond together the top and bottom substrates.   
     
     
         13 . The method as claimed in  claim 12  further comprising fixing a spacing between the top substrate and the bottom substrate by holding the top substrate with respect to the bottom substrate at a desired distance while curing the adhesive. 
     
     
         14 . A method of manufacturing a liquid crystal device comprising:
 providing a compressible liquid crystal retaining barrier on a bottom substrate that comprises a material with a low potential for liquid crystal contamination;   providing liquid crystal on the substrate within the retaining barrier;   providing a top substrate to enclose the liquid crystal with a seal against the retaining barrier; and   bonding the top substrate to the bottom substrate.   
     
     
         15 . The method as claimed in  claim 14  wherein the retaining barrier is provided in liquid form and cured on said bottom substrate. 
     
     
         16 . The method as claimed in  claim 1 , wherein said liquid crystal device is a lens. 
     
     
         17 . The method as claimed in  claim 16 , wherein the lens is a GRIN lens. 
     
     
         18 .- 40 . (canceled) 
     
     
         41 . The method as claimed in  claim 12 , wherein said liquid crystal device is a lens. 
     
     
         42 . The method as claimed in  claim 41 , wherein the lens is a GRIN lens. 
     
     
         43 . The method as claimed in  claim 14 , wherein said liquid crystal device is a lens. 
     
     
         44 . The method as claimed in  claim 43 , wherein the lens is a GRIN lens.