Printed circuit board bonding device

Abstract

A bonding device for bonding a flexible printed circuit board (PCB) to a printhead assembly includes an enclosed work area; a first heater assembly provided within the enclosed work area and movable along a first path; a bending mechanism provided within the enclosed work area and adapted to bend the bonded PCB; a second heater assembly provided within the enclosed work area and movable along a second path; a nest structure for receiving the printhead assembly, the nest structure movable along a third path; and a control system to control operation of the heater assemblies, bending mechanism, and nest structure. The first path and the second path are constrained to an area within the enclosed work area, and the third path crosses a boundary of the enclosed work area.

1 . A bonding device for bonding a flexible printed circuit board (PCB) to a printhead assembly, the printhead assembly having a printhead carrier and an ink ejection printhead carried by the carrier, the bonding device comprising:
 an enclosed work area;   a first heater assembly provided within the enclosed work area and movable along a first path;   a bending mechanism provided within the enclosed work area and adapted to bend the bonded PCB;   a second heater assembly provided within the enclosed work area and movable along a second path;   a nest structure for receiving the printhead assembly, the nest structure movable along a third path; and   a control system to control operation of the heater assemblies, bending mechanism, and nest structure, wherein   the first path and the second path are constrained to an area within the enclosed work area, and the third path crosses a boundary of the enclosed work area.   
     
     
         2 . A bonding device as claimed in  claim 1 , wherein the heater assemblies are rectilinearly constrained to move along their respective paths. 
     
     
         3 . A bonding device as claimed in  claim 1 , wherein the bending mechanism includes a bending member movable along a rectilinear path. 
     
     
         4 . A bonding device as claimed in  claim 1 , wherein
 the control system includes an operator control panel and a plurality of control actuators configured to control the operation of the bending mechanism and the heater assemblies,   the control actuators include a pair of buttons configured to operate exclusively on concurrent depression of the buttons, and   the pair of buttons are spaced apart to prevent operation thereof by one hand.