Heat sink for an electronic component

Abstract

Described is a heat sink for an electronic component. In at least one embodiment, the heat sink includes several cooling fins and carbon nanotubes, present between the top surface of the heat sink and the cooling fins. The carbon nanotubes extend from the top surface of the heat sink in the direction toward one of the cooling fins and are oriented at an angle to the orientation of the associated cooling fin.

1 . A heat sink with for an electronic component, comprising:
 cooling fins; and   carbon nanotubes, disposed between a top surface of the heat sink and the cooling fins, the carbon nanotubes extending from the top surface of the heat sink toward at least one of the cooling fins and being oriented at an angle to an orientation of the at least one associated cooling fin.   
     
     
         2 . The heat sink with for an electronic component according to  claim 1 , wherein a base area of the electronic component rests against the heat sink and is relatively smaller than the top surface of the heat sink, wherein the carbon nanotubes extend from the top surface of the heat sink toward several cooling fins, and wherein the angle of orientation for the carbon nanotubes associated with different cooling fins is different. 
     
     
         3 . The heat sink with an electronic component according to  claim 1 , further comprising one plate-type region respectively assigned to each of the cooling fins, each including uniformly oriented carbon nanotubes disposed therein. 
     
     
         4 . The heat sink with an electronic component according to  claim 3 , wherein the plate-type region includes an approximately trapezoid shape, a length of a top surface of the trapezoid shape corresponding approximately to a length of the electronic component and with a length of an underside of the trapezoid shape approximately corresponding to a length of the associated cooling fin. 
     
     
         5 . The heat sink with an electronic component according to  claim 3 , wherein carbon nanotubes are present in an edge region of the plate-type region, each of the carbon nanotubes being orientable at an angle other than zero, relative to the other carbon nanotubes of the plate-type region. 
     
     
         6 . The heat sink with an electronic component according to  claim 1 , wherein carbon nanotubes are present in the cooling fins, the carbon nanotubes being oriented in a direction toward an exposed end of a respective cooling fin, or at an angle thereto, or transverse thereto. 
     
     
         7 . The heat sink with an electronic component according to  claim 1 , wherein the carbon nanotubes are embedded in a substrate. 
     
     
         8 . A heat sink for an electronic component, comprising:
 cooling fins; and   carbon nanotubes, disposed between a top surface of the heat sink and the cooling fins, the carbon nanotubes extending from the top surface of the heat sink in a direction toward at least one of the cooling fins and being oriented at an angle to an orientation of the at least one associated cooling fin.   
     
     
         9 . The heat sink for an electronic component according to  claim 8 , wherein a base area of the electronic component which can rest against the heat sink is relatively smaller than the area of the top surface of the heat sink, wherein the carbon nanotubes extend from the top surface of the heat sink in a direction toward several of the cooling fins, and wherein the angles of orientation for the carbon nanotubes associated with different cooling fins are different. 
     
     
         10 . The heat sink for an electronic component according to  claim 4 , wherein carbon nanotubes are present in an edge region of the plate-type region, each of the carbon nanotubes being orientable at an angle other than zero, relative to the other carbon nanotubes of the plate-type region. 
     
     
         11 . The heat sink for an electronic component according to  claim 2 , further comprising one plate-type region respectively assigned to each of the cooling fins, each including uniformly oriented carbon nanotubes disposed therein. 
     
     
         12 . The heat sink for an electronic component according to  claim 11 , wherein the plate-type region includes an approximately trapezoid shape, a length of a top surface of the trapezoid shape corresponding approximately to a length of the electronic component and with a length of an underside of the trapezoid shape approximately corresponding to a length of the associated cooling fin. 
     
     
         13 . The heat sink for an electronic component according to  claim 11 , wherein carbon nanotubes are present in an edge region of the plate-type region, each of the carbon nanotubes being orientable at an angle other than zero, relative to the other carbon nanotubes of the plate-type region. 
     
     
         14 . The heat sink for an electronic component according to  claim 12 , wherein carbon nanotubes are present in an edge region of the plate-type region, each of the carbon nanotubes being orientable at an angle other than zero, relative to the other carbon nanotubes of the plate-type region.